Method for operating chemical mechanical polishing ("CMP") tool for the manufacture of semiconductor devices
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorsChien Hua Chen, Yuan Hsin Peng, Xiao Hua Li
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Abstract
A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
Claims20
A method for processing integrated circuit devices including a water recycling process, the process comprising:
- operating a chemical mechanical planarization process, the chemical mechanical planarization process including a discharge for process water, the process water being used to process one or more semiconductor wafers;
- selectively discharging process water from the discharge;
- transferring the process water from the chemical mechanical planarization process to a facility process;
- and
- using the discharged water in the facility process.
A method for processing integrated circuit devices including a water recycling process, the process comprising:
- operating a chemical mechanical polishing process using an incoming stream of ultra-pure water, the chemical mechanical polishing process including a discharge for used ultra-pure water, the ultra-pure water being used to process one or more semiconductor wafers and discharged through the discharge to form a facility water;
- selectively discharging the facility water from the discharge of the chemical mechanical polishing process and transferring the facility water from the discharge of the chemical mechanical polishing process to a facility process, the transferring being free from any chemical treatment of the discharged process water;
- and
- using the discharged water in the facility process.
A system for chemical mechanical polishing, the system comprising:
- a plurality of processing stations, each of the processing stations being configured to perform at least one processing operation;
- a discharge line coupled to one or more of the processing stations to receive discharge water;
- a valve coupled to the discharge line to selectively output the discharge water for use in a facility process;
- and
- a drain line coupled to the discharge line for outputting the discharge water to a drain.
Dependencies are inferred from the claim text.