Modular barrier removal polishing slurry
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsQianqiu Ye, Matthew VanHanehem, John Quanci
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Abstract
An aqueous slurry is useful for chemical mechanical planarizing a semiconductor substrate. The slurry includes by weight percent, 0.1 to 25 oxidizing agent, 0.1 to 20 silica particles having an average particle size of less than 200 nm, 0.005 to 0.8 polyvinyl pyrrolidone for coating the silica particles, 0.01 to 10 inhibitor, 0.001 to 10 complexing agent and a balance water and incidental impurities; and the aqueous slurry having a pH of at least 7.
Claims10
An aqueous slurry useful for chemical mechanical planarizing a semiconductor substrate comprising by weight percent, 0.1 to 25 oxidizing agent, 0.1 to 20 silica particles having an average particle size of less than 200 nm, 0.005 to 0.8 polyvinyl pyrrolidone for coating the silica particles, 0.01 to 10 inhibitor for decreasing removal rate of at least one nonferrous metal, 0.001 to 10 complexing agent for the nonferrous metal and a balance water and incidental impurities;
- and the aqueous slurry having a pH of at least 7.
An aqueous slurry useful for chemical mechanical planarizing a semiconductor substrate comprising by weight percent, 0.1 to 10 oxidizing agent, 0.1 to 15 silica particles having an average particle size of 5 to 150 nm, 0.05 to 0.8 polyvinyl pyrrolidone for coating the silica particles, 0.01 to 5 total azole inhibitor for decreasing removal rate of at least one nonferrous metal, 0.001 to 5 complexing agent for the nonferrous metal and a balance water and incidental impurities;
- and the aqueous slurry having a pH of 7.5 to 12.
Dependencies are inferred from the claim text.