Method for producing polymer-free area on a substrate

The method as recited in one of the preceding claims,

• wherein polymer-free bonding areas are produced on the substrate by applying the peelable layer at the places on the substrate where bonding takes place.

The method as recited in one of the preceding claims,

• wherein the peelable layer(s) is (are) applied by spraying, by brushing, by a dispenser or by screen printing, a template preferably being used for spraying and brushing.

The method as recited in one of the preceding claims,

• wherein the peelable layer is formed from a water-based polymer dispersion and/or from an organic polymer solution, the peelable layer preferably being based on a rubber including gutta percha, nitrile rubber, polyisoprene, polybutadiene and/or polyisobutylene.

The method as recited in one of the preceding claims,

• wherein the peelable layer is removed by vacuum.

The method as recited in one of the preceding claims,

• wherein the hermetically sealed connection of the diode-protective cap to the substrate is produced physically in the polymer-free area and/or chemically using adhesive.

The method as recited in one of the preceding claims,

• wherein the diode-protective cap and/or the substrate is comprised of glass or substrate polymer.

The method as recited in one of the preceding claims,

• wherein the diode-protective cap and the substrate have identical coefficients of expansion.

The method as recited in one of the preceding claims,

• wherein a plurality of diodes is situated under one diode-protective cap.

A use of the peelable layer as recited in one of the preceding claims to produce polymer-free areas on one substrate.

The product as recited in one of the preceding claims including at least one substrate, at least one peelable layer which is suitable for producing polymer-free areas on the substrate and, if necessary, at least one diode, preferably an organic light-emitting diode.