Method of improving copper interconnect of semiconductor devices for bonding
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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Abstract
An improved wire bond with the bond pads of semiconductor devices and the lead fingers of lead frames or an improved conductor lead of a TAB tape bond with the bond pad of a semiconductor device. More specifically, an improved wire bond wherein the bond pad on a surface of the semiconductor device comprises a layer of copper and at least one layer of metal and/or at least a barrier layer of material between the copper layer and one layer of metal on the copper layer to form a bond pad.
Claims6
A method of forming a semiconductor device assembly, said method comprising:
- providing a substrate having an upper surface and a lower surface;
- depositing a layer of copper on one surface of the upper surface and the lower surface of the substrate;
- patterning the layer of copper on one surface of the upper surface and the lower surface of the substrate to form at least one bond pad thereon;
- depositing at least one layer of metal on at least a portion of the layer of copper;
- and
- connecting one end of a conductor lead of a TAB tape to the at least one layer of metal.
A method of forming a semiconductor device assembly, said method comprising:
- providing a substrate having an upper surface and a lower surface;
- depositing a layer of copper on one surface of the upper surface and the lower surface of the substrate;
- patterning the layer of copper on one surface of the upper surface and the lower surface of the substrate to form at least one bond pad thereon;
- depositing at least one layer of gold metal on at least a portion of the layer of copper;
- and
- connecting one end of a conductor lead of a TAB tape to the at least one layer of gold metal.
A method of forming a semiconductor device assembly having a substrate having an upper surface and a lower surface, said method comprising:
- depositing a layer of copper on one surface of the upper surface and the lower surface of the substrate;
- patterning the layer of copper on one surface of the upper surface and the lower surface of the substrate to form at least one bond pad thereon;
- depositing at least one layer of metal on at least a portion of the layer of copper;
- and
- connecting one end of a conductor lead of a TAB tape to the at least one layer of metal.
A method of forming a semiconductor device assembly having a substrate having an upper surface and a lower surface, said method comprising:
- depositing a layer of copper on one surface of the upper surface and the lower surface of the substrate;
- patterning the layer of copper on one surface of the upper surface and the lower surface of the substrate to form at least one bond pad thereon;
- depositing at least one layer of gold metal on at least a portion of the layer of copper;
- and
- connecting one end of a conductor lead of a TAB tape to the at least one layer of gold metal.
Dependencies are inferred from the claim text.