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US 2004/0171231 A1Published application
Bonding system and semiconductor substrate manufacturing method
OwnerKazutaka Yanagita, Kenji Yamagatainventors
Life of this patent
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Abstract
A unit which overlays first and second substrates, after the surfaces of the first and second substrates are cleaned and/or activated, is accommodated in a chamber, and the interior of the chamber is isolated from an outer space. In the chamber isolated from the outer space, the state of the surfaces of the first and second substrates is measured. The surfaces of the first and second substrates are cleaned on the basis of the measurement result. After that, the first and second substrates are overlaid.
Claims22
A bonding system comprising:
- a processing unit which processes surfaces of first and second substrates;
- an operation unit which overlays the first and second substrates processed by said processing unit;
- and
- a chamber which accommodates and isolates from an outer space said processing unit and operation unit,
- wherein a process for the first and second substrates by said processing unit includes a process of cleaning and/or activating the surfaces of the first and second substrates.
2 more elements
A bonding system comprising:
- an operation unit which overlays first and second substrates;
- a chamber which accommodates said operation unit and isolates said operation unit from an outer space;
- and
- a humidity maintaining unit which maintains a humidity in said chamber to a substantially constant level.
1 more element
A bonding system comprising:
- a measurement unit which measures a state of surfaces of first and second substrates;
- a processing unit which processes the surfaces of the first and second substrates on the basis of a measurement result of said measurement unit;
- an operation unit which overlays the first and second substrates processed by said processing unit;
- and
- a chamber which accommodates said measurement unit, processing unit, and operation unit and isolates from an outer space,
- wherein a process for the first and second substrates by said processing unit includes a process of cleaning the surfaces of the first and second substrates.
3 more elements
Dependencies are inferred from the claim text.