1R1D R-RAM array with floating p-well
AssigneeSharp Laboratories of America, Inc.
InventorsSheng Teng Hsu, Wei Pan, Wei-Wei Zhuang, Fengyan Zhang
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AssigneeSharp Laboratories of America, Inc.
InventorsSheng Teng Hsu, Wei Pan, Wei-Wei Zhuang, Fengyan Zhang
Estimating the term…
A low-capacitance one-resistor/one-diode (1R1D) R-RAM array with a floating p-well is provided. The fabrication method comprises: forming an integrated circuit (IC) substrate; forming an n-doped buried layer (buried n layer) of silicon overlying the substrate; forming n-doped silicon sidewalls overlying the buried n layer; forming a p-doped well of silicon (p-well) overlying the buried n layer; and, forming a 1R1D R-RAM array overlying the p-well. Typically, the combination of the buried n layer and the n-doped sidewalls form an n-doped well (n-well) of silicon. Then, the p-well is formed inside the n-well. In other aspects, the p-well has sidewalls, and the method further comprises: forming an oxide insulator overlying the p-well sidewalls, between the n-well and the R-RAM array.
A method for fabricating a one-resistor/one-diode (1R1D) R-RAM array with a floating p-well, the method comprising:
A method for forming a one-resistor/one-diode (1R1D) R-RAM with reduced bit line capacitance, the method comprising:
A one-resistor/one-diode (1R1D) R-RAM with a floating p-well, the R-RAM comprising:
Dependencies are inferred from the claim text.