Method and apparatus for packaging electronic components
AssigneeAzimuth Industrial Company, Inc.
InventorDavid Lee
Life of this patent
Estimating the term…
Abstract
A method of fabricating a component package for components such as integrated circuits and a component package. A carrier is molded to form a plurality of cavities. A lid is molded to define a vent hole corresponding to each of the cavities. Components, such as integrated circuit dies, are mounted on the carrier in each of the cavities. A curable adhesive is applied to the top of the sidewalls defining the cavities. The top cover is pressed against the top of the sidewalls with a vent hole aligned with each cavity. The adhesive is then cured under heat. The curing process not only cures the adhesive, it vents moisture from the cavities. The vent holes are then sealed using a curable adhesive. The assembly is cut into individual integrated circuit packages.
Claims14
A method of packaging at least one component, comprising:
- providing a lid having a plurality of vent holes;
- molding sidewalls onto a substrate to form a plurality of cavities surrounding a component-mounting surface;
- mounting a component on the component-mounting surface in each cavity;
- applying a curable adhesive to a top surface of the sidewalls;
- placing the lid upon the top surface of the sidewalls such that at least one vent hole is aligned with each cavity;
- curing said adhesive, said vent hole providing a path for outgassing during curing;
- sealing said vent holes to form a component package assembly having a plurality of cavities, separated by sidewalls;
- and
- separating the component package assembly into a plurality of individual component packages.
Apparatus comprising:
- a carrier comprising a substrate having a component mounting surface and a plurality of sidewalls molded to the substrate and arranged to define a plurality of cavities;
- a lid comprising a plurality of vent holes, where each of the vent holes is aligned with a cavity, and the lid is attached to the carrier;
- a component positioned in each cavity and bonded to the component mounting surface.
Dependencies are inferred from the claim text.