Semiconductor device and its manufacturing method

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a semiconductor chip including a main surface, a plurality of semiconductor elements formed over the main surface, and a plurality of electrodes;
• providing a wiring substrate including an insulating base layer provided with a main surface and a back surface, a plurality of wiring lines formed over the main surface of the insulating base layer, and through holes formed in the insulating base layer;
• forming gold salient electrodes respectively over the electrodes of the semiconductor chip;
• disposing the wiring substrate over the main surface of the semiconductor chip through an adhesive interposed between the back surface of the insulating base layer and the main surface of the semiconductor chip;
• thereafter, applying pressure to the wiring substrate to bring the gold salient electrodes and the wiring lines into mutual contact in the interiors of the through holes, and applying heat to the adhesive to let the adhesive cure;
• and
• forming a plurality of solder salient electrodes over the main surface of the wiring substrate in such a manner that the solder salient electrodes are connected to the plural wiring lines,
• wherein the plural solder salient electrodes are arranged in a lattice shape of plural rows and columns at a pitch larger than a minimum pitch of the electrodes of the semiconductor chip, and
• wherein the solder salient electrodes are arranged over the main surface of the semiconductor chip through the adhesive and the insulating base layer.

A semiconductor module comprising:

• a module substrate having a plurality of connecting electrodes over a main surface thereof and a plurality of external electrode terminals over a back surface thereof, predetermined ones of the external electrode terminals and predetermined ones of the connecting electrodes being electrically connected together through conductors extending through the module substrate;
• one or more semiconductor devices mounted over the main surface of the module substrate;
• a semiconductor element mounted over at least one said semiconductor device and having a plurality of electrodes over an exposed main surface thereof,
• predetermined ones of the electrodes over the semiconductor element and predetermined ones of the connecting electrodes over the module substrate being connected together through conductive wires,
• the connecting electrodes to which the wires over the main surface of the module substrate are connected having a pitch larger than a minimum pitch of the plural electrodes formed over the main surface of the semiconductor element,
• the semiconductor device comprising:
• a semiconductor chip including a main surface, a plurality of semiconductor elements formed over the main surface, and a plurality of electrodes;
• gold salient electrodes formed respectively over the electrodes of the semiconductor chip;
• a wiring substrate having an insulating base layer provided with a main surface and a back surface, a plurality of wiring lines formed over the main surface of the insulating base layer, and through holes formed in the insulating base layer;
• and
• a plurality of solder salient electrodes formed over the main surface of the wiring substrate and connected respectively to the plural wiring lines,
• wherein the wiring substrate is disposed in such a manner that the back surface of the insulating base layer is opposed to the main surface of the semiconductor chip,
• wherein the back surface of the insulating base layer and the main surface of the semiconductor chip are bonded with each other through an adhesive,
• wherein the gold salient electrodes are connected respectively to the wiring lines of the wiring substrate in the interiors of the through holes,
• wherein the plural solder salient electrodes are arranged in a lattice shape of plural rows and columns at a pitch larger than a minimum pitch of the electrodes of the semiconductor chip,
• wherein the solder salient electrodes are arranged over the main surface of the semiconductor chip through the adhesive and the insulating base layer, and
• wherein the solder salient electrodes are connected to the connecting electrodes formed over the main surface of the module substrate.