Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
AssigneeSony Corporation
InventorsJinichi Morimura, Hiroya Matsuda
Life of this patent
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Abstract
A semiconductor integrated circuit card is disclosed in which such a semiconductor integrated circuit chip device comprising a substrate having a circuit pattern formed thereon, a semiconductor circuit chip bonded onto the substrate and having an electrode connected to the circuit pattern, a reinforcement metal plate, and a seal resin portion for covering a peripheral face of the semiconductor integrated circuit chip and sticking the reinforcement metal plate onto the semiconductor integrated circuit chip is mounted within a card substrate.
Claims15
A method for manufacturing a semiconductor integrated circuit card comprising the steps of:
- forming a circuit pattern on a substrate;
- bonding a plurality of semiconductor integrated circuit chips onto a first surface of said substrate having the circuit pattern formed thereon, and also connecting electrodes of said semiconductor integrated circuit chips to said circuit pattern;
- applying a first seal resin onto each of said semiconductor integrated circuit chips;
- disposing a first reinforcement metal plate above said first seal resin;
- pressurizing said first seal resin via said first reinforcement metal plate so as to let flow said first seal resin along a peripheral face of said semiconductor integrated circuit chips;
- hardening said seal resin flown along the peripheral face of said semiconductor integrated circuit chips;
- and
- thereafter dividing a product into a semiconductor integrated circuit chip at every circuit pattern.
A semiconductor integrated circuit card comprising:
- a substrate having a circuit pattern formed thereon;
- a semiconductor integrated circuit chip bonded onto said substrate and having an electrode connected to said circuit pattern;
- a first reinforcement metal plate disposed on a surface of said semiconductor integrated circuit chip;
- a first seal resin portion disposed on a peripheral face of said semiconductor integrated circuit chip and sticking said first reinforcement metal plate;
- and
- a resin layer covering said semiconductor integrated circuit chip.
Dependencies are inferred from the claim text.