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US 2004/0171191 A1Published application
Stacked semiconductor package with circuit side polymer layer
AssigneeMicron Technology, Inc.
InventorsMike Connell, Tongbi Jiang
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on the circuit side configured as stress defect barrier. A method for fabricating the package includes the steps of forming bumps on the die, encapsulating the bumps in a polymer layer, and then planarizing the polymer layer and the bumps to form the planarized wire bonding contacts. The method also includes the steps of attaching and wire bonding the die to the substrate, and then forming the die encapsulant on the die.
Claims58
A semiconductor package comprising:
- a substrate;
- a die encapsulant on the substrate;
- and
- a semiconductor die attached to the substrate and encapsulated in the die encapsulant, the die comprising a circuit side, an insulating layer on the circuit side, a plurality of contacts on the circuit side, and a polymer layer on the circuit side encapsulating the contacts and preventing physical contact between the die encapsulant and the circuit side.
1 more element
A semiconductor package comprising:
- a substrate;
- a die encapsulant on the substrate;
- and
- a semiconductor die wire bonded and attached to the substrate, the die comprising a circuit side, an insulating layer on the circuit side, a plurality of die contacts on the circuit side, a plurality of planarized bumps on the die contacts, and a planarized polymer layer on the circuit side encapsulating the bumps and preventing physical contact between the die encapsulant and the circuit side.
1 more element
A semiconductor package comprising:
- a substrate having a first surface, a second surface, a plurality of conductors on the first surface, and an opening;
- a semiconductor die having a circuit side attached to the second surface, the die comprising a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- a plurality of wires in the opening bonded to the wire bonding contacts and to the conductors;
- and
- a die encapsulant encapsulating the die.
2 more elements
A semiconductor package comprising:
- a substrate having a surface and plurality of conductors on the surface;
- a semiconductor die having a circuit side and a back side attached to the surface, the die comprising a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- a plurality of wires bonded to the wire bonding contacts and to the conductors;
- a second die attached to the circuit side of the die;
- and
- an adhesive member attaching the second die to the circuit side, the polymer layer preventing physical contact between the circuit side and the adhesive member.
3 more elements
A semiconductor package comprising:
- a substrate comprising a plurality of lead fingers;
- a semiconductor die having a circuit side and a back side attached to the surface, the die comprising a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- a plurality of wires bonded to the wire bonding contacts and to the lead fingers;
- and
- a die encapsulant encapsulating the die and at least a portion of the lead fingers, the polymer layer preventing physical contact between the circuit side and the die encapsulant.
2 more elements
A semiconductor package comprising:
- a substrate;
- a die encapsulant on the substrate;
- and
- a first die attached to the substrate and encapsulated in the die encapsulant, the first die comprising a circuit side, an insulating layer on the circuit side, a plurality of contacts on the circuit side, and a polymer layer on the circuit side encapsulating the contacts and preventing physical contact between the die encapsulant and the circuit side;
- a second die substantially identical to the first die, the second die stacked on the first die and encapsulated in the die encapsulant.
2 more elements
A method for fabricating a semiconductor package comprising:
- providing a semiconductor die comprising a circuit side, an electrically insulating layer on the circuit side, and a plurality of bumps on the circuit side;
- forming a polymer layer on the insulating layer and on the bumps leaving surfaces of the bumps exposed;
- attaching the die to a substrate;
- bonding wires to the surfaces and to the substrate;
- and
- forming a die encapsulant on the die.
3 more elements
A method for fabricating a semiconductor package comprising:
- providing a semiconductor die comprising a circuit side, a plurality of die contacts on the circuit side, and an electrically insulating layer on the circuit side;
- forming a plurality of bumps on the die contacts;
- forming a polymer layer on the insulating layer and on the bumps;
- planarizing the polymer layer and the bumps;
- providing a substrate;
- attaching the die to the substrate;
- bonding wires to the bumps and to the substrate;
- and
- forming a die encapsulant on the die with the polymer layer preventing physical contact between the die encapsulant and the circuit side.
6 more elements
A method for fabricating a semiconductor package comprising:
- providing a semiconductor die comprising a circuit side, a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- providing a substrate comprising a first surface, a second surface, a plurality of conductors on the first surface and an opening from the first surface to the second surface;
- attaching the circuit side to the second surface;
- bonding wires through the opening to the wire bonding contacts and to the conductors;
- and
- encapsulating the die in a plastic material in physical contact with the polymer layer.
3 more elements
A method for fabricating a semiconductor package comprising:
- providing a semiconductor die comprising a circuit side, a back side, a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- providing a substrate comprising a segment of a lead frame comprising a plurality of lead fingers;
- attaching the circuit side to the lead fingers;
- bonding wires to the wire bonding contacts and to the lead fingers;
- and
- encapsulating the die and at least a portion of the substrate in a plastic material in physical contact with the polymer layer.
3 more elements
A system in a package comprising:
- a module substrate;
- at least one semiconductor package on the module substrate, the package comprising
- a substrate having a first surface, a second surface and an opening;
- a semiconductor die having a circuit side attached to the second surface, the die comprising a plurality of die contacts on the circuit side, an insulating layer on the circuit side, a plurality of wire bonding contacts bonded to the die contacts, and a polymer layer on the circuit side encapsulating the wire bonding contacts;
- a plurality of wires in the opening bonded to the wire bonding contacts and to the conductors;
- and
- a die encapsulant encapsulating the die.
4 more elements
A system in a package comprising:
- a package substrate comprising a plurality of terminal leads;
- and
- a package mounted to the substrate comprising:
- a substrate;
- a die encapsulant on the substrate;
- and
- a semiconductor die wire bonded and attached to the substrate, the die comprising a circuit side, an insulating layer on the circuit side, a plurality of die contacts on the circuit side, a plurality of planarized bumps on the die contacts, and a planarized polymer layer on the circuit side encapsulating the bumps and preventing physical contact between the die encapsulant and the circuit side.
4 more elements
Dependencies are inferred from the claim text.