Circuit substrate device, method for producing the same, semiconductor device and method for producing the same

A method for producing a circuit substrate device comprising:

• a circuit unit forming step of forming a circuit unit through a release layer, said circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor;
• a substrate forming step of forming a multi-layer wiring substrate including a connecting portion exposed from a major surface thereof;
• a bonding step of connecting said circuit unit to the major surface of said multi-layer wiring substrate for connecting said land unit to said connecting portion, and
• a removing step of removing said dummy substrate and said release layer by releasing said release layer from said circuit unit.

A method for producing a circuit substrate device comprising:

• a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, via a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor,
• an inspecting step of subjecting said set of circuits to preset inspection as to whether or not said pattern conductor has been properly formed, from one circuit unit to another;
• a splitting step of splitting said dummy substrate and said set of circuits, as said set of circuits has been formed on said dummy substrate, from one circuit unit to another;
• a sorting step of accepting only the circuit unit the pattern conductor of which has been found in said inspecting step to have been formed properly;
• a substrate forming step of forming a multi-layer wiring substrate including a connecting portion exposed from a major surface thereof;
• a bonding step of bonding said circuit unit, accepted in said inspecting step, to the major surface of said multi-layer wiring substrate so that said land unit is bonded to the major surface of said multi-layer wiring substrate;
• and
• a removing step of removing said dummy substrate and the release layer by peeling at said release layer from said circuit unit.

A method for producing a circuit substrate device comprising:

• a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, through a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor;
• a substrate set forming step of forming a set of a plurality of multi-layer wiring substrates arrayed side by side in a facing relationship to said circuit units of said circuit set, each multi-layer wiring substrate including a connecting portion exposed from the major surface thereof;
• a bonding step of bonding said circuit set to said substrate set so that the land unit of said circuit unit is connected to the connecting portion of said multi-layer wiring substrate lying in a facing relationship to said land unit;
• a removing step removing said dummy substrate and the release layer by peeling said release layer from said circuit set;
• and
• a splitting step of splitting said circuit set and the substrate set in a lump, as said circuit set and the substrate set are bonded to each other, from one circuit unit to another.

A method for producing a circuit substrate device comprising:

• a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, via a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor,
• an inspecting step of subjecting said set of circuits to preset inspection as to whether or not said pattern conductor has been properly formed, from one circuit unit to another;
• a substrate forming step of forming a multi-layer wiring substrate including a connecting portion exposed from a major surface thereof;
• a bonding step of bonding said multi-layer wiring substrate only to the circuit unit, the pattern conductor of which has been found in said inspecting step to have been formed properly, so that said land unit is connected to said connecting portion;
• a removing step of removing said dummy substrate and the release layer so that said release layer is peeled from said circuit set;
• and
• a splitting step of splitting said circuit set into said circuit units as said multi-layer wiring substrate is attached thereto.

A semiconductor device comprising:

• a circuit substrate unit including a circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor, said circuit substrate also including a multi-layer wiring substrate including a connecting portion exposed from a major surface thereof;
• and
• a semiconductor chip mounted on said circuit substrate unit by being electrically connected to said pattern conductor;
• wherein
• said circuit substrate unit being so formed that said circuit unit is formed via a release layer on a dummy substrate, having a flattened out surface, said circuit unit being bonded to the major surface of said multi-layer wiring substrate so that said land unit is connected to said connecting portion, said dummy substrate and the release layer being then removed by peeling at said release layer to form said circuit unit on the major surface of said multi-layer wiring substrate.

A method for producing a semiconductor device comprising:

• a circuit substrate forming step of forming a circuit substrate by a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, via a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layer(s), said land unit connecting to said pattern conductor, an inspecting step of subjecting said set of circuits to preset inspection as to whether or not said pattern conductor has been properly formed, from one circuit unit to another, a splitting step of splitting said dummy substrate and said set of circuits, as said set of circuits has been formed on said dummy substrate, from said circuit unit to another, a sorting step of accepting only the circuit set the pattern conductor of which has been found in said inspecting step to have been formed properly, a substrate forming step of forming a multi-layer wiring substrate including a connecting portion exposed from a major surface thereof, a bonding step of bonding said circuit unit, accepted in said inspecting step, to the major surface of said multi-layer wiring substrate so that said land unit is bonded to said connecting portion, and a removing step removing said dummy substrate and the release layer by peeling at said release layer;
• and
• a mounting step of mounting said semiconductor chip on said circuit substrate by electrically connecting said pattern conductor to said semiconductor chip.

A method for producing a semiconductor device comprising:

• a circuit substrate forming step of forming a circuit substrate by a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, via a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layers, said land unit connecting to said pattern conductor, a substrate set forming step of forming a set of a plurality of multi-layer wiring substrates arrayed side by side in a facing relationship to said circuit units of said circuit set, each multi-layer wiring substrate including a connecting portion exposed from the major surface thereof, a bonding step of bonding said circuit set to said substrate set so that the land unit of said circuit unit is connected to the connecting portion of said multi-layer wiring substrate lying in a facing relationship to said land unit, a removing step removing said dummy substrate and the release layer by peeling at said release layer, and a splitting step of splitting said circuit set and said substrate set in a lump from one circuit unit to another, as said circuit set and the substrate set are bonded to each other, and
• a mounting step of mounting said semiconductor chip on said circuit substrate by electrically connecting said pattern conductor to said semiconductor chip.

A method for producing a semiconductor device comprising:

• a circuit substrate forming step of forming a circuit substrate by a circuit set forming step of forming a set of circuits, comprised of a plurality of circuit units arrayed side by side, via a release layer, each circuit unit having one or more wiring layers each having a pattern conductor formed by a thin film technique, and an insulating layer, said circuit unit also having a land unit, on an uppermost layer of said wiring layers, said land unit connecting to said pattern conductor, an inspecting step of subjecting said set of circuits to preset inspection as to whether or not said pattern conductor has been properly formed, from one circuit unit to another, a substrate forming step of forming a multi-layer wiring substrate including a connecting portion exposed from the major surface, a bonding step of bonding said multi-layer wiring substrate only to the circuit unit the pattern conductor of which has been found in said inspection step to have been formed properly, so that said land is connected to said connecting portion, a removing step removing said dummy substrate and the release layer by peeling said release layer from said circuit set, and a splitting step of splitting said set of circuits, as said set of circuits has been bonded to said multi-layer wiring substrate, into said circuit units;
• and
• a mounting step of mounting said semiconductor chip on said circuit substrate by electrically connecting said pattern conductor to said semiconductor chip.