Thin-film electronic device module
AssigneeOSRAM Opto Semiconductors GmbH
InventorKarl Pichler
Life of this patent
Estimating the term…
Abstract
In an embodiment of this invention, an encapsulated electronic thin-film device includes a substrate and an active area is fabricated on the substrate. The active area is comprised of at least one electronic thin-film element. A thin-film encapsulation layer is selectively deposited on at least the active area to cover at least the active area. Traces protrude slightly past a perimeter of the thin-film encapsulation layer. The traces are routed to two or more contact pads to which one or more connectors can attach. Attaching the connector to the contact pads allows an external device to be coupled to the active area of the electronic thin-film device.
Claims30
An encapsulated electronic thin-film device, comprising:
- a substrate;
- an active area on said substrate, said active area includes at least one electronic thin-film element;
- a thin-film encapsulation layer that covers at least said active area, said thin-film encapsulation layer is selectively deposited;
- and
- a plurality of conducting traces coupled to said active area, said plurality of conducting traces protrude slightly past a perimeter of said thin-film encapsulation layer.
A method to encapsulate an electronic thin-film device, comprising:
- fabricating an active area on a substrate, said active area includes at least one electronic thin-film element, wherein fabricating said active area includes patterning a plurality of conductive traces that are coupled to said at least one electronic thin-film element;
- and
- selectively depositing a thin-film encapsulation layer on at least said active area to cover at least said active area,
- wherein said plurality of conductive traces are patterned such that they protrude slightly past a perimeter of said thin-film encapsulation layer.
Dependencies are inferred from the claim text.