Resist material and nanofabrication method
AssigneeSony Corporation
InventorsAkira Kouchiyama, Katsuhisa Aratani
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AssigneeSony Corporation
InventorsAkira Kouchiyama, Katsuhisa Aratani
Estimating the term…
A resist material and a nanofabrication method provide high-resolution nanofabrication without an expensive irradiation apparatus using, for example, electron beams or ion beams. That is, the resist material and the nanofabrication method provide finer processing using exposure apparatuses currently in use. A resist layer of an incompletely oxidized transition metal such as W and Mo is selectively exposed and developed to be patterned in a predetermined form. The incompletely oxidized transition metal herein is a compound having an oxygen content slightly deviated to a lower content from the stoichiometric oxygen content corresponding to a possible valence of the transition metal. In other words, the compound has an oxygen content lower than the stoichiometric oxygen content corresponding to a possible valence of the transition metal.
A resist material comprising an incompletely oxidized transition metal having an oxygen content lower than the stoichiometric oxygen content corresponding to a possible valence of the transition metal.
A nanofabrication method comprising the steps of depositing a resist layer of a resist material including an incompletely oxidized transition metal having an oxygen content lower than the stoichiometric oxygen content corresponding to a possible valence of the transition metal on a substrate;
Dependencies are inferred from the claim text.