Methods for preparing ball grid array substrates via use of a laser
OwnerFrank L. Hallinventor
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
Claims6
A method of enhancing the adhesion of a compound to a surface of a substrate comprising:
- providing said substrate having said surface;
- and
- roughening the surface of the substrate.
A method of enhancing the adhesion of a material to a surface of a substrate comprising:
- providing said substrate having said surface;
- and
- roughening the surface of the substrate.
A method for improving adhesion of a compound to a surface of a substrate comprising:
- providing said substrate having said surface;
- and
- roughening the surface of the substrate.
Dependencies are inferred from the claim text.