Process for producing high temperature heat resisting carrier foil clad electrolytic copper foil and high temperature heat resisting carrier foil clad electrolytic copper foil obtained by the process

A method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance which involves forming an organic adhesive interface layer on a surface of carrier foil by use of an organic agent and forming an electrodeposited copper foil layer on the organic adhesive interface layer, wherein the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling and melting the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed and that a simple adsorbed organic film is further formed by causing the adsorption of the organic agent to occur by bringing an aqueous solution in which the organic agent is dispersed and the acid pickled and absorbed organic film into contact with each other.

A method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, a dissimilar metal layer using any one of kind selected from the group consisting of nickel, nickel alloys, cobalt and cobalt alloys is formed on the organic adhesive interface layer, and an electrodeposited copper foil layer is provided on the dissimilar metal layer, wherein the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling and melting the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed and that said dissimilar metal layer is formed on the organic adhesive interface layer as a thin-film metal layer having a thickness of 0.001 μm to 0.05 μm.

A method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, a dissimilar metal layer using any one of kind selected from the group consisting of nickel, nickel alloys, cobalt and cobalt alloys is formed on the organic adhesive interface layer, and an electrodeposited copper foil layer is provided on the dissimilar metal layer, wherein the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling and melting the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed, that a simple adsorbed organic film is further formed by bringing an aqueous solution in which the organic agent is dispersed and the acid pickled and absorbed organic film into contact with each other and thereby causing the adsorption of the organic agent to occur, and that said dissimilar metal layer is formed on the organic adhesive interface layer as a thin-film metal layer having a thickness of 0.001 μm to 0.05 μm.