Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
AssigneeFurukawa Circuit Foil Co., Ltd.
InventorsYasuhisa Yoshihara, Hisao Kimijima
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AssigneeFurukawa Circuit Foil Co., Ltd.
InventorsYasuhisa Yoshihara, Hisao Kimijima
Estimating the term…
An electromagnetic shielding copper foil superior in electromagnetic shielding ability, high in transmittance, and free from particle shedding comprising a copper foil on at least one surface of which a fine roughening particle layer of copper or an alloy is provided and having on the fine roughening particle layer a smoothening layer comprised of cobalt, nickel, indium, or an alloy of the same and an electromagnetic shield able to be suitably used for a PDP using the same. The fine roughening particle layer may also be a layer comprised of a fine particle roughening particle layer of copper on which a fine roughening particle layer of a copper alloy is stacked or may also be formed by a copper-cobalt-nickel alloy. The smoothening layer of the copper foil may be treated for stainproof or by a silane coupling agent to protect the surface of the copper foil.
An electromagnetic shielding copper foil comprising a copper foil or a copper alloy foil on at least one surface of which a fine roughening particle layer comprising fine roughening particles is provided.
An electromagnetic shielding copper foil comprising a copper foil or a copper alloy foil on at least one surface of which is provided a fine roughening particle layer on which a smoothening layer comprising one of the group of metals of cobalt, nickel, indium and alloys of the same is provided.
A method of production of an electromagnetic shielding copper foil comprising providing on a least one surface of a copper foil or a copper alloy foil a first fine roughening particle layer comprising one of the group of metals of copper, a copper-cobalt alloy, a cobalt-nickel alloy and a copper-cobalt-nickel alloy, providing on said first fine roughening particle layer a second fine roughening particle layer comprising one of the group of metals of a copper-cobalt alloy, a cobalt-nickel alloy and a copper-cobalt-nickel alloy, and providing on said second fine roughening particle layer a smoothening layer comprising one of the group of metals of cobalt, nickel, indium and alloys of the same.
Dependencies are inferred from the claim text.