Device cover having a gapped adhesive preform thereon for covering a device on an electronic substrate
OwnerKevin Kwong-Tai Chunginventor
Life of this patent
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Abstract
A device cover for covering a device on an electronic substrate according to the invention comprises a cover having a bonding surface defining a closed bonding pattern, and a bonding pattern of adhesive on the bonding surface of the cover. The bonding pattern of adhesive has at least one gap therein, wherein the gap is sufficiently small as to be filled by the adhesive when the adhesive flows when the cover is adhered to the electronic substrate.
Claims20
A device cover for covering a device on an electronic substrate comprising:
- a cover having a bonding surface defining a closed bonding pattern;
- a bonding pattern of flowable adhesive on the bonding surface of said cover, wherein said bonding pattern of flowable adhesive is a flowable adhesive preform in the shape of the closed bonding pattern, and wherein said bonding pattern of flowable adhesive has at least one gap therein,
- wherein the gap in said bonding pattern of flowable adhesive is sufficiently small as to be filled by said flowable adhesive when said flowable adhesive flows when the cover is adhered to the electronic substrate,
- whereby a seal having a shape defined by the shape of the closed bonding pattern is formed between the cover and the electronic substrate by the flowed bonding pattern of flowable adhesive.
A device cover for a device on an electronic substrate, said device cover having a gapped adhesive preform disposed on a bonding surface thereof and adapted to flow for attaching the cover to the electronic substrate comprising:
- a cover having a bonding surface adapted for receiving adhesive and defining a closed bonding pattern;
- an adhesive preform of flowable adhesive in the shape of the bonding pattern disposed on the bonding surface of said cover, wherein said flowable adhesive preform has at least one gap therein,
- wherein the at least one gap is sufficiently small as to be filled by said flowable adhesive when said flowable adhesive flows for attaching the cover to the electronic substrate,
- whereby a seal having a shape defined by the shape of the bonding pattern is formed between the cover and the electronic substrate by the flowed bonding pattern of flowable adhesive.
A hollow device cover for covering a device on an electronic substrate, said hollow device cover having a gapped adhesive preform disposed on a bonding surface thereof and adapted to flow for attaching the hollow device cover to the electronic substrate, said hollow device cover comprising:
- a hollow cover having an open end defining a bonding surface adapted for receiving adhesive and defining a closed bonding pattern;
- a preform of melt-flowable adhesive formed in the shape of the bonding pattern and disposed on the bonding surface of said hollow cover, wherein said melt-flowable adhesive preform has two or more gaps therein,
- wherein each of the two or more gaps is sufficiently small as to be filled by said melt-flowable adhesive when said melt-flowable adhesive flows for attaching the cover to the electronic substrate,
- whereby a seal having a shape defined by the closed bonding pattern is formed between the hollow cover and the electronic substrate by the flowed bonding pattern of flowable adhesive.
Dependencies are inferred from the claim text.