Lasable bond-ply materials for high density printed wiring boards
AssigneeAlliedSignal Inc.
InventorsDavid R. Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J. Pommer
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Abstract
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
Claims35
A bond-ply material comprising a core having a first surface and a second surface wherein the core has a thickness of from about 5 microns to 200 microns and including from about 20% and 70% non-woven reinforcement material selected from glass microfibers, organic fibers and mixtures thereof impregnated with a polymer.
A method for interconnecting high density electronic circuits comprising the steps of:
- (a) forming a bond-ply material comprising a core having a first surface and a second surface wherein the core has a thickness of from about 5 microns and 200 microns and including from about 20% and 70% non-woven reinforcement material selected from glass microfibers, organic fibers and mixtures thereof impregnated with a polymer,
- (b) forming a plurality of vias in the bond-ply material;
- (c) filling the vias with an electrically conductive material selected from a conductive paste or conductor precursor;
- (d) placing the bond-ply material between a first circuit element having at least one circuit region and a second circuit element having at least one circuit region such that the electrically conductive material located in at least one via contacts at least one circuit region associated with the first circuit element and at least one circuit region associated with the second circuit element to form an uncured multi-layer circuit;
- and
- (e) curing the uncured multi-layer circuit at a pressures of from 0 and 1000 psi and at a temperature of from 25 to about 400° C. to form a cured multi-layer circuit.
A multilayer printed circuit board fabricated using a bond-ply material comprising a core having a first surface and a second surface wherein the core has a thickness of from about 5 microns and 200 microns and including from about 20% and 70% non-woven reinforcement material selected from glass microfibers, organic fibers and mixtures thereof impregnated with a polymer.
The bond-ply material of claim 34, further comprising a B-stage resin layer having a thickness of from about 2 micrometers to about 200 micrometers and covers the core first surface, the core second surface, or both the core first surface and the core second surface.
The bond-ply material of claim 34, wherein the core is a C-stage core.
The bond-ply material of claim 34, wherein the plurality of vias is perpendicular to the plane of the material.
The bond-ply material of claim 34, wherein the nonwoven reinforcing material is a mixture of micro-fiber glass and organic fibers.
The bond-ply material of claim 34, including a plurality of essentially undamaged laser ablated vias having diameters of from 5 to 150 micrometers.
The bond-ply material of claim 34, wherein the electrically conductive material comprises a conductive paste, a conductive ink, a conductive polymer or mixtures thereof.
The bond-ply material of claim 34, wherein the conductor precursor generates a conductive material upon heat treatment.
Dependencies are inferred from the claim text.