Electroless plating method and device, and substrate processing method and apparatus
OwnerHiroaki Inoue, Norio Kimura +2inventors
InventorsHiroaki Inoue, Norio Kimura, Kenji Nakamura, Moriji Matsumoto
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Abstract
There is provided an electroless plating method and device which can form a plated film having an improved uniformity of film thickness with an enhanced selectivity, while preventing the formation of fine pores in the plated film. The electroless plating method comprises, bringing a substrate into contact with an electroless plating solution to form a plated film on the surface of the substrate, and scrubbing the surface of the plated film formed or being formed on the surface of the substrate.
Claims17
An electroless plating method, comprising:
- bringing a substrate into contact with an electroless plating solution to form a plated film on a surface of the substrate;
- and
- scrubbing the surface of said plated film formed or being formed on the surface of the substrate.
A electroless plating method, comprising:
- bringing a substrate into contact with an electroless plating solution to form a plated film on a surface of the substrate;
- scrubbing the surface of said plated film formed on the surface of the substrate;
- and
- repeating said bringing and said scrubbing.
An electroless plating device, comprising:
- a substrate holder for detachably holding a substrate and bringing the substrate into contact with an electroless plating solution;
- and
- means for scrubbing the surface of the substrate which is held by said substrate holder and is in contact with the electroless plating solution.
A substrate processing method comprising the steps of:
- polishing a surface of a substrate;
- and
- electroless plating the polished surface of the substrate immediately after said polishing step.
A substrate processing apparatus, comprising:
- a polishing device for polishing a surface of a substrate;
- and
- an electroless plating device for carrying out electroless plating to selectively form a plated film as a protective film on said polished surface of the substrate.
A substrate having a plated film, said plated film having been formed by a process comprising bringing a substrate into contact with an electroless plating solution to form a plated film while the surface of said plated film formed or being formed on a surface of the substrate is being scrubbed.
Dependencies are inferred from the claim text.