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US 2004/0170524 A1Published application
Unleaded solder
OwnerPetra Lambracht, Markus Rettenmayr +2inventors
InventorsPetra Lambracht, Markus Rettenmayr, Christoph Tschudin, Souad Arsalane
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Abstract
The invention concerns a lead-free solder comprising a bismuth-based alloy. The lead-free solder has a proportion of at least 80 percent by weight of bismuth and a solidus temperature of at least 260° C.
Claims17
Lead-free solder consisting of an alloy on the basis of bismuth with a proportion of at least 80 percent by weight of bismuth and with a solidus temperature of at least 260° C.
Dependencies are inferred from the claim text.