Conduits integrated in circuit board and method of manufacture
AssigneeMotorolr, Inc.
InventorsClaudia V. Gamboa, Manes Eliacin, Keryn K. Lian
Life of this patent
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Abstract
Circuit boards (1100, 1400) and methods for fabricating circuit boards that include conduits (1004) are provided. The conduits formed by patterning a metal layer (1102) are lined by inert coating (1106) and caped by a photodefinable polymer layer (1110) that is affixed to the inert coating by with the help of an initially uncured polymer layer (1106). Holes are formed by patterning the photodefinable polymer layer for admitting and removing fluid from the conduit.
Claims20
An integrated electromechanical apparatus comprising:
- a support;
- a first layer supported on the support;
- one or more grooves in the first layer, the one or more grooves characterized by a depth;
- a coating of a first material over the first layer, said coating conforming to the one or more grooves, wherein the coating is at least in part thinner than the depth of the one or more grooves;
- a photodefined cap layer supported on the coating sealingly engaged with the coating, so as to form one or more conduits in the one or more grooves.
A method of fabricating an integrated electromechanical apparatus, the method comprising:
- obtaining a support with a first layer supported on the support;
- patterning the first layer to form one or more grooves;
- coating the first layer with a first material;
- attaching a film to the first material;
- whereby, the film closes the one or more grooves forming one or more conduits.
The method according to claim 10 wherein:
- obtaining a support with a first layer supported on the support comprises:
- obtaining a support with a layer of copper supported on the support.
Dependencies are inferred from the claim text.