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AssigneeHitachi High-Technologies Corporation
InventorsMichio Nakano, Shigeya Tanaka, Yoshiyuki Momiyama, Takashi Hiroi, Kazuya Hayashi, Dai Fujii, Takako Fujisawa, Atsushi Ichige, Ichiro Kawashima
Estimating the term…
An image processing apparatus for wafer inspection tool that is able to perform continuously cell to cell comparison inspection, die to die comparison inspection, and cell-to-cell and die-to-die hybrid comparison inspection, employing a plurality of processors. This image processing apparatus for wafer inspection tool comprises a plurality of processors for performing parallel processing, means for cutting out image data including a forward end overlap and a rear end overlap at partition boundaries in order to cut serial data into a predetermined image size, means for distributing the cutout image data to the plurality of processors, and means for assembling results of processing performed by the plurality of processors. The forward end overlap is set greater than a pitch of the cell subject to cell to cell comparison inspection.
An image processing apparatus for wafer inspection tool to perform visual inspection by die to die comparison and/or cell to cell comparison, using serial image data of an object which has a plurality of dice each having an identical circuitry pattern formed thereon or a plurality of cells on a die each having an identical circuitry pattern formed thereon, said image processing apparatus comprising:
Dependencies are inferred from the claim text.