Heat dissipating device and electronic apparatus including the same
AssigneeKabushiki Kaisha Toshiba
InventorsNobuto Fujiwara, Kenichi Ishikawa
Life of this patent
Estimating the term…
Abstract
A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the receiving surface, a heat transferring unit mounted on the dissipating surface, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the dissipating surface, and a heat dissipating unit mounted on the dissipating surface and dissipating the diffused heat. An electronic apparatus includes a circuit board having an electronic part generating heat, a main body installing the circuit board, and the heat dissipating device described above.
Claims20
A heat dissipating device which dissipates heat from a heat generating object, comprising:
- a heat receiving unit having a heat receiving surface and a heat dissipating surface in an opposite side of the heat receiving surface, the heat receiving surface being thermally connected to the heat generating object;
- a heat transferring unit mounted on the heat dissipating surface of the heat receiving unit, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the heat dissipating surface;
- and
- a heat dissipating unit mounted on the heat dissipating surface of the heat receiving unit, and dissipating the diffused heat.
A heat dissipating device which dissipates heat from a heat generating object, comprising:
- a heat receiving unit having a heat receiving surface and a heat dissipating surface in an opposite side of the heat receiving surface, the heat receiving surface being thermally connected to the heat generating object;
- a heat transferring unit mounted on the heat receiving surface of the heat receiving unit with excluding a part of the heat receiving surface thermally connected to the heat generating object, transferring the heat received in the heat receiving unit, and diffusing the transferred heat to the heat dissipating surface;
- and
- a heat dissipating unit mounted on the heat dissipating surface of the heat receiving unit, and dissipating the diffused heat.
An electronic apparatus, comprising:
- a circuit board including an electronic part generating heat;
- a main body installing the circuit board;
- and
- a heat dissipating device dissipating the heat from the electronic part,
- the heat dissipating device including
- a heat receiving unit having a heat receiving surface and a heat dissipating surface in an opposite side of the heat receiving surface, the heat receiving surface being thermally connected to the electronic part;
- a heat transferring unit mounted on the heat dissipating surface of the heat receiving unit, transferring the heat received in the heat receiving unit, and diffusing the transferred heat to the heat dissipating surface;
- and
- a heat dissipating unit mounted on the heat dissipating surface of the heat receiving unit, and dissipating the diffused heat.
Dependencies are inferred from the claim text.