Coated heat spreaders
AssigneeIntel Corporation
InventorsJoan K. Vrtis, Joni G. Hansen, Thomas J. Fitzgerald, Carl L. Deppisch
Life of this patent
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Abstract
A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.
Claims23
A method comprising:
- providing a thermally conductive heat spreader body having a first surface configured to thermally couple the heat spreader to an IC die;
- and
- coating the first surface with an organic surface protectant.
A heat spreader for an IC circuit package, comprising:
- a thermally conductive heat spreader body having a first surface configured to thermally couple the heat spreader to an IC die;
- and
- a coating of organic surface protectant on the first surface.
An IC package, comprising:
- a package substrate;
- an IC die attached to the substrate;
- a heat spreader body having a first surface thermally coupled to the IC die;
- and
- a coating of organic surface protectant disposed between the first surface and the IC die.
A printed circuit board assembly comprising:
- a printed circuit board,
- an IC die electronically coupled to the printed circuit board, and
- a heat spreader body having a first surface thermally coupled to the IC die;
- and
- a coating of organic surface protectant disposed between the first surface and the IC die.
Dependencies are inferred from the claim text.