US 2004/0169849 A1Published application

Surface foreign matter inspecting device

AssigneeMatsushita Electric Industrial Co., Ltd.

InventorsSyunsuke Kimura, Yoshiharu Yamamoto

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Abstract

A surface foreign matter inspection device is provided with which the NA can be enlarged with a simple configuration, and a shortening of the time required for foreign matter inspection as well as a high detection sensitivity can be achieved. The device is provided with an optical detection means 6 that irradiates light from an radiation optical system onto the surface of an object under inspection on a stage, reflects light scattered by foreign matter on the object under inspection and turns the reflected light into parallel light, condenses the parallel light with a condensing lens, and detects the condensed light, as well as an information processing device 100 for processing an electrical signal from the optical detection means 6 and position information regarding the foreign matter on the object under inspection 4.

Claims13

Dependent claims

A surface foreign matter inspection device using an optical means to inspect foreign matter on an object under inspection, comprising:

a stage on which the object under inspection is placed and moved;
a light irradiation means for irradiating light onto a surface of the object under inspection;
a focusing means comprising a first cylindrical mirror that reflects light scattered by foreign matter on the object under inspection and turns the reflected light into parallel light, and a condensing means for condensing the parallel light;
an optical detection means for receiving the condensed light from the condensing means and converting an intensity of the condensed light into an electrical signal;
and
an information processing device for processing the electrical signal that is output from the optical detection means and position information regarding the foreign matter on the object under inspection.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/482,544Filed 30 Dec 2003
Priority: JP 2002-4991826 Feb 2002
Published: 2 Sep 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

G01N 21/94
Investigating the presence of flaws or contamination: investigating contamination, e.g. dust
G01N 21/8806
Investigating the presence of flaws or contamination: specially adapted optical and illumination features
G01N 21/9501
Characterised by the material or shape of the object to be examined: semiconductor wafers
G01N
Investigating or analysing materials by determining their chemical or physical properties