Back to results
US 2004/0169833 A1Published application
Exposure apparatus and exposure method
AssigneeCanon Kabushiki Kaisha
InventorHiroshi Tanaka
Life of this patent
Estimating the term…
Abstract
Alignment marks (PMOL, PMOR, and FXY01 to FXY04) for measuring a wafer position are formed on a wafer (W) by projecting alignment mark patterns (PM and FM) arranged on a reticle reference plate (PL) fixed on a reticle stage (RSTG) which supports a reticle.
Claims20
An exposure apparatus which projects a pattern on an original onto a substrate, comprising:
- an original stage which supports the original;
- a substrate stage which supports the substrate;
- a reference pattern which is arranged on said original stage and to align said original stage and said substrate stage;
- and
- a mark which is arranged on said original stage, has a known relative position from the reference pattern, and is to be projected onto the substrate to form an alignment mark on the substrate.
2 more elements
An exposure method of projecting a pattern on an original onto a substrate, comprising steps of:
- measuring a position of an alignment mark formed on the substrate;
- projecting the pattern onto the substrate based on a measurement result in said measurement step;
- and
- projecting onto the substrate based on the measurement result, a mark which has a known relative position from a reference pattern arranged on an original stage and to align the original stage and a substrate stage, and is arranged on the original stage and to form an alignment mark on the substrate.
1 more element
Dependencies are inferred from the claim text.