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US 2004/0169763 A1Published application
Camera module and manufacturing method thereof
AssigneeSanyo Electric Co., Ltd.
InventorOsamu Ikeda
Life of this patent
Estimating the term…
Abstract
A camera module for a mobile device is reduced in size and production cost. A lens being essentially same in size as an image sensor chip is bonded to a surface of the image sensor chip. An IR filter is bonded to the lens and an iris material is provided onto the IR filter. Bump electrodes formed on a back surface of the image sensor chip are connected to a printed circuit board.
Claims17
A camera module comprising:
- an image sensor chip comprising a semiconductor chip having a photoelectronic transducer formed on a first portion of a front surface of the semiconductor chip and having an electrode pad formed on a second portion of the front surface and connected to a terminal for external connection disposed on a back surface of the semiconductor chip;
- and
- a lens bonded to the image sensor chip.
A method of manufacturing a camera module comprising:
- providing an image sensor wafer comprising a plurality of image sensor chips, each of the image sensor chips comprising a photoelectronic transducer and a terminal for external connection;
- providing a lens array comprising a plurality of lenses, each of the lenses being configured to cover a corresponding image sensor chip;
- bonding the lens array to a surface of the image sensor wafer to form a bonded assembly;
- and
- dividing the bonded assembly into individual camera modules so that each of the camera modules comprises one of the image sensor chips and one of the lenses.
2 more elements
A method of manufacturing a camera module comprising:
- providing an image sensor wafer comprising a plurality of image sensor chips, each of the image sensor chips comprising a photoelectronic transducer and a terminal for external connection;
- providing a lens array comprising a plurality of lenses, each of the lenses being configured to cover a corresponding image sensor chip;
- providing a filter and an iris portion;
- bonding the image sensor wafer, the lens array, the filter and the iris portion together to form a bonded assembly;
- and
- dividing the bonded assembly into individual camera modules so that each of the camera modules comprises one of the image sensor chips and one of the lenses.
3 more elements
A method of manufacturing a camera module comprising:
- providing an image sensor wafer comprising a plurality of image sensor chips, each of the image sensor chips comprising a photoelectronic transducer and a terminal for external connection;
- providing a lens array comprising a plurality of lenses, each of the lenses being configured to cover a corresponding image sensor chip;
- bonding the lens array to a surface of the image sensor wafer to form a bonded assembly;
- mounting an additional lens over each of the lens;
- and
- dividing the bonded assembly into individual camera modules so that each of the camera modules comprises one of the image sensor chips and one of the lenses.
3 more elements
A camera module comprising:
- an image sensor chip comprising a photoelectronic transducer;
- and
- a lens bonded to the image sensor chip, the lens comprising a lens body and a lens frame, wherein a surface of the lens frame is configure to serve as a barrel of the camera module.
Dependencies are inferred from the claim text.