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US 2004/0169451 A1Published application
Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
AssigneeCitizen Electronics Co., Ltd.
InventorsNodoka Oishi, Koichi Fukasawa, Sadato Imai
Life of this patent
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Abstract
A light emitting element has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting chip is secured to the base at an exposed mounting area. The light emitting chip is electrically connected to the conductive patterns.
Claims15
A light emitting element comprising:
- a base made of heat conductive material and having a heat radiation surface formed on a surface thereof;
- at least one wire plate made of an insulation material and secured to an upper surface of the base;
- exposing means for forming an exposed mounting area on the surface of the base;
- conductive patterns formed on the wire plate;
- a light emitting chip secured to the base at the mounting area;
- and
- connecting means for electrically connecting the light emitting chip to the conductive patterns.
4 more elements
A light emitting device comprising:
- a base made of heat conductive material and having a flat plate shape and a heat radiation surface formed on a surface thereof;
- at least one wire plate made of an insulation material and secured to an upper surface of the base;
- exposing means for forming an exposed mounting area on the surface of the base;
- conductive patterns secured to the wire plate;
- a light emitting chip secured to the base at the mounting area;
- connecting means for electrically connecting the light emitting chip to the conductive patterns;
- a print substrate having conductive patterns provided on an underside thereof and secured to the conductive patterns on the wire plate so as to electrically connect both the conductive patterns.
4 more elements
A light emitting device comprising:
- a base made of heat conductive material and having a flat plate shape and a heat radiation surface formed on a surface thereof;
- at least one wire plate made of an insulation material and secured to an upper surface of the base;
- exposing means for forming an exposed mounting area on the surface of the base;
- conductive patterns secured to the wire plate;
- a light emitting chip secured to the base at the mounting area;
- connecting means for electrically connecting the light emitting chip to the conductive patterns;
- heat pipes projected from a side wall of the base;
- and
- a heat radiation member secured to ends of the heat pipes.
6 more elements
A light emitting device having a plurality of heat emitting elements, each of the light emitting elements comprising:
- a base made of heat conductive material and having a flat plate shape and a heat radiation surface formed on a surface thereof;
- at least one wire plate made of an insulation material and secured to an upper surface of the base;
- exposing means for forming an exposed mounting area on the surface of the base;
- conductive patterns secured to the wire plate;
- a light emitting chip secured to the base at the mounting area;
- connecting means for electrically connecting the light emitting chip to the conductive patterns;
- wherein
- the light emitting device has a heat radiation member made of a flexible material, and the light emitting elements are supported on a surface of the heat radiation member.
5 more elements
A method for manufacturing light emitting elements comprising the steps of:
- preparing a wire plate aggregation having a plurality of divisions, and preparing a base aggregation having a same size as the wire plate aggregation;
- forming a mounting hole in each division of the wire plate aggregation, and providing a plurality of conductive patterns on each division;
- securing the wire plate aggregation and the base aggregation with each other;
- mounting a light emitting chip on the wire plate aggregation at the mounting hole;
- electrically connecting the light emitting chip with the conductive patterns by wires;
- encapsulating the light emitting chip and wires by encapsulating member;
- and
- dicing the aggregation of the light emitting elements.
5 more elements
Dependencies are inferred from the claim text.