Method of producing piezoelectric component and piezoelectric component
AssigneeMurata Manufacturing Co., Ltd.
InventorsMasato Higuchi, Nobushige Araki, Hideki Shinkai
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave element is mounted onto a mounting substrate having a terminal electrode via a bump by flip chip bonding. The surface acoustic wave element is covered with a resin film. The periphery of the surface acoustic wave element mounted on the mounting substrate is covered with a portion of the resin film so that the surface acoustic wave element is sealed. The resin film is hardened. Thus, a surface acoustic wave device is provided.
Claims38
A method of producing a piezoelectric component comprising the steps of:
- forming a plurality of piezoelectric elements having a vibrating portion and a bump on a substrate;
- mounting the plurality piezoelectric elements on a mounting substrate having external terminals via the bumps by flip chip bonding such that the vibrating portions are opposed to the mounting substrate;
- arranging a resin film on the mounting substrate having the plurality of piezoelectric elements mounted thereon;
- sealing the plurality of piezoelectric elements by embedding the resin film between adjacent ones of the piezoelectric elements mounted on the mounting substrate;
- hardening the resin film;
- and
- splitting the mounting substrate by dicing to form individual piezoelectric components;
- wherein
- the sealing step includes a step of hot-press bonding in which the resin film is heated, softened, and simultaneously pressed by a roller.
A piezoelectric component comprising:
- a piezoelectric element having a vibrating portion provided on a surface of a substrate;
- a mounting substrate having an external terminal and onto which the piezoelectric element is mounted by flip chip bonding via a bump, the surface of the piezoelectric element on which the vibrating portion is provided opposes the mounting substrate;
- and
- a resin sealing the piezoelectric element mounted onto the mounting substrate;
- wherein
- the resin has a volume resistivity of up to about 1010 Ω·m.
A piezoelectric component comprising:
- a piezoelectric element having a vibrating portion provided on a surface of a substrate;
- a mounting substrate having an external terminal and onto which the piezoelectric element is mounted by flip chip bonding via a bump, the surface of the piezoelectric element on which the vibrating portion is provided is opposed to the mounting substrate;
- and
- a resin sealing the piezoelectric element mounted onto the mounting substrate;
- wherein
- the piezoelectric element has a back-surface conductive layer disposed on the back surface thereof.
A piezoelectric component comprising:
- a piezoelectric element having a vibrating portion provided on a surface of a substrate;
- a mounting substrate having an external terminal and onto which the piezoelectric element is mounted by flip chip bonding via a bump, the surface of the piezoelectric element on which the vibrating portion is formed is opposed to the mounting substrate;
- and
- a resin sealing the piezoelectric element mounted onto the mounting substrate;
- wherein
- the resin has a surface conductive layer disposed thereon.
A method of producing a surface acoustic wave device comprising the steps of:
- forming a plurality of surface acoustic wave elements including at least one interdigital electrode and a bump formed on the surface of a piezoelectric substrate;
- mounting the plurality of surface acoustic wave elements on a mounting substrate having external terminals via the bumps by flip chip bonding such that the at least one interdigital electrode is opposed to the mounting substrate;
- arranging a resin film on the mounting substrate having the plurality of surface acoustic wave elements mounted thereon;
- sealing the plurality of surface acoustic wave elements by embedding the resin film between adjacent ones of the surface acoustic wave elements mounted on the mounting substrate;
- hardening the resin film;
- and
- splitting the mounting substrate by dicing to form the individual surface acoustic wave devices.
Dependencies are inferred from the claim text.