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US 2004/0169292 A1Published application
Standoffs for centralizing internals in packaging process
AssigneeMicron Technology, Inc.
InventorsStephen L. James, Vernon M. Williams
Life of this patent
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Abstract
A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.
Claims121
A semiconductor device, comprising:
- a semiconductor die having a first surface and a second surface;
- the first surface having at least one standoff disposed thereon, the standoff having a height.
A semiconductor device, comprising:
- a semiconductor die having a first surface and a second surface;
- the first surface having a plurality of standoffs disposed thereon, each of the standoffs having a height;
- wherein when the die is positioned in a mold cavity between two mold plates, the height of the standoffs is sufficient to contact an inner surface of the mold plates to maintain the die in a centralized and substantially planar orientation within the mold cavity during an encapsulation process.
A semiconductor device, comprising:
- a semiconductor die having a first surface and a second surface;
- the first surface having at least one standoff disposed thereon, the standoff having a height, and a plurality of conductive balls disposed on the second surface of the semiconductor die.
A semiconductor device, comprising:
- a support substrate having opposing sides, each side having a semiconductor die mounted thereon;
- each die having a first surface and a second surface, the second surface of the die disposed on the support substrate, and the first surface of the die having at least one standoff disposed thereon, the standoff having a height.
A semiconductor device, comprising:
- a support substrate comprising a flexible tape having opposing sides, and a semiconductor die mounted on each side of the support substrate;
- each die having a first surface with at least one standoff disposed thereon, the standoff having a height, and a second surface having a plurality of conductive balls disposed thereon and mounted on the support substrate.
A semiconductor device, comprising:
- a semiconductor die having at least one standoff disposed thereon, the standoff comprising a thermally conductive heat sink material.
A semiconductor device, comprising:
- a semiconductor die having at least one standoff disposed thereon, the standoff encompassing a heat sink material disposed on the die.
A semiconductor device, comprising:
- a semiconductor die having at least one standoff disposed thereon, and a heat sink material disposed on the die adjacent the standoff.
A semiconductor device, comprising:
- a support substrate having a first side and a second side;
- and a semiconductor die having a first surface with at least one standoff disposed thereon, the standoff having a height, and a second surface disposed on the first side of the support substrate;
- the second side of the support substrate having at least one standoff disposed thereon, the standoff having a height;
- wherein when the device is positioned in a mold cavity between two mold plates, the height of the standoffs is sufficient to contact an inner surface of the mold plates to maintain the support substrate in a centralized and substantially planar orientation within the mold cavity during an encapsulation process.
1 more element
A semiconductor device, comprising:
- a semiconductor die having a first surface and a second surface, the first surface of the die having at least one standoff disposed thereon, and the second surface of the die disposed on a first side of a support substrate, and at least one standoff disposed on a second side of the support substrate;
- wherein when the device is positioned in a mold cavity between two mold plates, the standoffs each have a height sufficient to contact an inner surface of the mold plates to maintain the support substrate in a centralized and substantially planar orientation within the mold cavity during an encapsulation process.
A semiconductor die package, comprising an encapsulated semiconductor device, the semiconductor device comprising:
- a support substrate having opposing sides;
- and a semiconductor die mounted on each side of the support substrate;
- each die having a first surface with at least one standoff disposed thereon, the standoff having a height, and a second surface disposed on the support substrate.
A semiconductor die package, comprising an encapsulated semiconductor device, the semiconductor device comprising first and second semiconductor dies mounted on opposing sides of a polyimide tape substrate;
- each die having a first surface and a second surface, the first surface having at least one standoff disposed thereon, the standoff having a height, and the second surface of the die disposed on the tape substrate.
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material, the package having a first surface and a second surface;
- the semiconductor device comprising first and second semiconductor dies mounted on opposing sides of a support substrate;
- each die having a first surface and a second surface, the first surface having at least one standoff disposed thereon, the standoff having a height, and the second surface of the die disposed on the support substrate;
- wherein the standoff extends from the first surface of the die to about the surface of the package, and the support substrate is centrally disposed between the first and second surfaces of the package.
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material, the package having a first surface and a second surface;
- the semiconductor device comprising first and second semiconductor dies mounted on opposing sides of a polyimide tape substrate;
- each die having a first surface and a second surface, the first surface having at least one standoff disposed thereon, the standoff having a height, and the second surface of the die disposed on the polyimide tape substrate;
- wherein the standoff extends from the first surface of the die to about the surface of the package, and the polyimide tape substrate is centrally disposed between the first and second surfaces of the package.
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material, the package having a first surface and a second surface;
- the semiconductor device comprising:
- a support substrate having a first side and a second side;
- and a semiconductor die having a first surface with at least one first standoff disposed thereon, the standoff having a height, and a second surface disposed on the first side of the support substrate, the second side of the support substrate having at least one second standoff disposed thereon;
- wherein the first and second standoffs extend, respectively, from the surface of the die and from the surface of the support substrate to about the surfaces of the package, and the support substrate is centrally disposed between the first and second surfaces of the package.
1 more element
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material, the package having a first surface and a second surface;
- the semiconductor device comprising first and second semiconductor dies mounted on opposing sides of a support substrate;
- each die having a first surface and a second surface, the second surface of the die disposed on the support substrate, and at least a portion of the first surface of each die exposed through the surfaces of the package;
- wherein the support substrate is centrally disposed between the first and second surfaces of the package.
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material, the package having a first surface and a second surface;
- the semiconductor device comprising a semiconductor die mounted on a first side of a support substrate, the die having a first surface and a second surface, the first surface having at least one standoff disposed thereon, and the second surface of the die disposed on a first side of a support substrate, and at least one standoff disposed on a second side of the support substrate;
- wherein the first and second standoffs extend, respectively, from the surface of the die and from the surface of the support substrate to about the surfaces of the package, and the support substrate is centrally disposed between the first and second surfaces of the package.
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material;
- the semiconductor device comprising:
- a support substrate having opposing sides;
- and a semiconductor die mounted on a side of the support substrate;
- the die having a first surface with at least one standoff disposed thereon, the standoff comprising a thermally conductive material.
1 more element
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material;
- the semiconductor device comprising:
- a support substrate having opposing sides;
- and a semiconductor die mounted on a side of the support substrate;
- the die having a first surface with at least one standoff disposed thereon, the standoff encompassing a heat sink disposed on the die.
1 more element
A semiconductor die package, comprising a semiconductor device disposed within an encapsulating material;
- the semiconductor device comprising:
- a support substrate having opposing sides;
- and a semiconductor die mounted on a side of the support substrate;
- the die having a first surface with at least one standoff disposed thereon, and a heat sink material disposed on the die adjacent the standoff.
1 more element
A mold tooling for fabricating a semiconductor die package, comprising:
- a pair of molding plates and a molding chamber disposed therebetween, each of the molding plates having an inner surface having at least one standoff disposed thereon, the standoff having a height effective to contact a surface of a die positioned within the molding chamber, and restrict vertical movement of the die within the molding chamber during an encapsulation process.
A mold tooling for fabricating a semiconductor die package, comprising:
- a pair of molding plates defining a molding chamber therebetween, each of the molding plates having an inner surface having at least one standoff disposed thereon, the standoff having a height effective to contact a surface of a die mounted on a support substrate and positioned within the molding chamber, and restrict vertical movement of the die and support substrate within the molding chamber during an encapsulation process.
A mold tooling for fabricating a semiconductor die package, comprising:
- a pair of molding plates and a molding chamber disposed therebetween, each of the molding plates having an inner surface having at least one standoff disposed thereon, the standoff having a height effective to contact a surface of a die mounted on a flexible tape substrate and positioned within the molding chamber, and restrict vertical movement of the die and flexible tape substrate within the molding chamber during an encapsulation process.
A method of fabricating a semiconductor device, comprising the steps of:
- providing a support substrate having a first surface and a second surface, each surface having terminal pads located thereon;
- providing a semiconductor die having a first surface with at least one standoff located thereon, and a second surface;
- and
- mounting the second surface of the die on the first surface of the substrate.
1 more element
A method of fabricating a semiconductor device, comprising the steps of:
- providing a support substrate having a first surface and a second surface;
- providing a semiconductor die having a first surface and a second surface;
- forming a standoff on the first surface of the die;
- and
- mounting the second surface of the die on the first surface of the substrate.
2 more elements
A method of fabricating a semiconductor device, comprising the steps of:
- providing a support substrate;
- providing a pair of semiconductor dies, each having a first surface and a second surface;
- forming a standoff on the first surface of each of the dies;
- and
- mounting the dies on opposing sides of the support substrate, the second surface of each of the dies disposed on the substrate.
2 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- providing a die/substrate unit comprising a semiconductor die disposed on a support substrate;
- the die having a first surface with one or more standoffs disposed thereon, the standoffs having a height, and a second surface disposed on the support substrate;
- providing a mold tooling comprising a pair of mold plates defining a molding chamber therebetween;
- the mold plates having an inner surface;
- positioning the die/substrate unit within the molding chamber of the mold tooling, with the standoffs in contact with the inner surfaces of the mold plates;
- and
- flowing a molding compound into the molding chamber to at least partially encapsulate the die/substrate unit, wherein the die/substrate unit is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
4 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- providing a die/substrate unit comprising a semiconductor die disposed on a support substrate;
- the die having a first surface with one or more standoffs disposed thereon, the standoffs having a height, and a second surface disposed on the support substrate;
- providing a mold tooling comprising a pair of mold plates defining a molding chamber therebetween;
- the mold plates having an inner surface;
- positioning the die/substrate unit within a molding chamber between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the die/substrate unit is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
4 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- providing a die/substrate unit comprising a semiconductor die disposed on a support substrate;
- the die having a first surface with one or more standoffs disposed thereon, the standoffs having a height, and a second surface disposed on the support substrate;
- providing a mold tooling comprising a pair of mold plates defining a molding chamber therebetween;
- the mold plates having an inner surface;
- positioning the die/substrate unit within a molding chamber between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the die/substrate unit is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
4 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- providing a semiconductor device comprising a pair of semiconductor dies disposed on opposing sides of a support substrate;
- each die having a first surface with one or more standoffs disposed thereon, and a second surface disposed on the support substrate;
- providing a mold tooling comprising a pair of mold plates defining a molding chamber therebetween;
- the mold plates having an inner surface;
- positioning the semiconductor device within a molding chamber disposed between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the support substrate of the semiconductor device is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
4 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- fabricating a semiconductor device by providing a pair of semiconductor dies, each having a first surface and a second surface;
- forming a standoff on the first surface of each of the dies;
- and mounting the dies on opposing sides of a support substrate, the second surface of each of the dies disposed on the substrate;
- positioning the semiconductor device within a molding chamber disposed between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the support substrate of the semiconductor device is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
3 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- fabricating a semiconductor device by providing a pair of semiconductor dies, each die having a standoff disposed on a first surface;
- and mounting the dies on opposing sides of a support substrate, the second surface of each of the dies disposed on the substrate;
- positioning the semiconductor device within a molding chamber disposed between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the support substrate of the semiconductor device is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
2 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- providing a semiconductor device comprising a pair of semiconductor dies disposed on opposing sides of a support substrate;
- each die having a first surface and a second surface disposed on the support substrate;
- providing a mold tooling comprising a pair of mold plates defining a molding chamber therebetween;
- each mold plate having an inner surface with a standoff disposed thereon;
- positioning the semiconductor device within the molding chamber between the mold plates such that the standoffs are in contact with the first surfaces of the dies;
- and
- introducing a molding compound into the molding chamber, wherein the support substrate of the semiconductor device is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
4 more elements
A method of fabricating a semiconductor die package, comprising the steps of:
- fabricating a semiconductor device by providing a pair of semiconductor dies, each die having a standoff disposed on a first surface;
- and mounting the dies on opposing sides of a support substrate, the second surface of each of the dies disposed on the substrate;
- positioning the semiconductor device within a molding chamber disposed between a pair of mold plates each having an inner surface, such that the standoffs are in contact with the inner surfaces of the mold plates;
- and
- introducing a molding compound into the molding chamber, wherein the support substrate of the semiconductor device is maintained in a centralized and substantially planar orientation within the molding chamber as the molding compound is flowed thereabout.
2 more elements
Dependencies are inferred from the claim text.