US 2004/0169289 A1 · Semiconductor device, a method of manufacturing the same and an electronic device · patentgrep

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Abstract

A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

Claims41

Dependent claims

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip, and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member in which one end side is positioned over the first electrode of the semiconductor chip and connected to the first electrode of the semiconductor chip through a first connecting means, and the other end side opposite to the one end side is positioned on the second main surface side of the resin sealing member relative to the one end side and exposed from the resin sealing member;
and
a second conductive member connected to the second electrode of the semiconductor chip through a second connecting means,
wherein the one end side of the first conductive member is exposed from the first main surface of the resin sealing member, and
wherein the second conductive member is exposed from the second main surface and side faces of the resin sealing member.

4 more elements

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip, and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member positioned over the first electrode of the semiconductor chip and connected to the first electrode of the semiconductor chip through a first connecting member, the first conductive member having a first portion exposed from the first main surface of the resin sealing member, a second portion formed integrally with the first portion and positioned in the interior of the resin sealing member, and a third portion formed integrally with the second portion and exposed from the second main surface of the resin sealing member;
and
a second conductive member connected to the second electrode of the semiconductor chip through a second connecting means and exposed from the second main surface of the resin sealing member.

2 more elements

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;
a second conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the second electrode of the semiconductor chip through a second connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;
and
a third conductive member connected to the third electrode of the semiconductor chip through a third connecting means and exposed from the second main surface of the resin sealing member,
wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member, and
wherein the first portion of the second conductive member is positioned in the interior of the resin sealing member.

5 more elements

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;
a second conductive member positioned outside the semiconductor chip and on the second main surface side of the resin sealing member relative to the first portion of the first conductive member;
and
a third conductive member connected to the third electrode of the semiconductor chip through a second connecting means and exposed from the second main surface of the resin sealing member,
wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member, and
wherein the second conductive member is connected electrically to the second electrode of the semiconductor chip through a bonding wire.

5 more elements

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and positioned on the second main surface side of the resin sealing member relative to the first portion;
and
a second conductive member having a first portion connected to the second electrode of the semiconductor chip through a second connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion,
wherein the first portion of the second conductive member is exposed from the second main surface of the resin sealing member, and
wherein the second portion of the second conductive member is exposed from the first and second main surfaces of the resin sealing member.

4 more elements

A semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, a first electrode formed over the first main surface, and a second electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member having a first portion connected to the first electrode of the semiconductor chip through a first connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion;
and
a second conductive member having a first portion connected to the second electrode of the semiconductor chip through a second connecting means and a second portion formed integrally with the first portion and larger in thickness than the first portion,
wherein the first portion of the first conductive member is exposed from the first main surface of the resin sealing member,
wherein the second portion of the first conductive member is exposed from the first and second main surfaces of the resin sealing member,
wherein the first portion of the second conductive member is positioned in the interior of the resin sealing member, and
wherein the second portion of the second conductive member is exposed from the second main surface of the resin sealing member.

6 more elements

An electronic device comprising a wiring substrate, a semiconductor device mounted over the wiring substrate, and a heat dissipating member disposed over the semiconductor device, the semiconductor device comprising:

a semiconductor chip having first and second main surfaces positioned on mutually opposite sides, first and second electrodes formed over the first main surface, and a third electrode formed over the second main surface;
a resin sealing member sealing the semiconductor chip and having first and second main surfaces positioned on mutually opposite sides, the first main surface being positioned on the first main surface side of the semiconductor chip, and the second main surface being positioned on the second main surface side of the semiconductor chip;
a first conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the first electrode of the semiconductor chip through a first connecting means and exposed from the first main surface of the resin sealing member, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and exposed from the second main surface of the resin sealing member;
a second conductive member having a first portion, a second portion, and a third portion, the first portion being connected to the second electrode of the semiconductor chip through a second connecting means and positioned in the interior of the resin sealing member, the second portion being formed integrally with the first portion, and the third portion being formed integrally with the second portion and exposed from the second main surface of the resin sealing member;
and
a third conductive member connected to the third electrode of the semiconductor chip through a third connecting means and exposed from the second main surface of the resin sealing member,
wherein the third portions of the first and second conductive members, as well as the third conductive member, are soldered to electrodes formed over the wiring substrate, and
wherein the first portion of the first conductive member is connected to the heat dissipating member through a heat conducting member.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/755,375Filed 13 Jan 2004
Priority: JP 2003-05463828 Feb 2003
Published: 2 Sep 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification28 codes

H10W 72/60
Interconnections or connectors in packages: strap connectors, e.g. thick copper clips for grounding of power devices
H10D 62/117
Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies: shapes of semiconductor bodies
H10W 70/424
Shapes or dispositions: cross-sectional shapes
H10W 70/481
Leadframes: for devices being provided for in groups H10D8/00 - H10D48/00

Family

US 6,992,385 B2Related patent
US 2004/0169289 A1This patent

From the US filing history. Foreign family members aren’t listed.

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