Multileveled printed circuit board unit including substrate interposed between stacked bumps

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• and
• an interposer substrate made of a porous material and interposed between the conductive bumps.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• and
• an interposer substrate formed by multilayered films made of different materials and interposed between the conductive bumps.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• a first conductive bump on a first level;
• a second conductive bump on a second level stacked on the first conductive bump between a printed wiring substrate and a mounted component, said second conductive bump having a size different from that of the first conductive bump;
• and
• an interposer substrate interposed between the first and second conductive bumps.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between the conductive bumps;
• and
• a conductive wiring pattern formed on the interposer substrate so as to electrically connect at least the conductive bumps arranged on an identical level.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between stacked conductive bumps;
• and
• a conductive pad disposed to surround an area receiving the conductive bumps on the interposer substrate so as to receive a connecting wire.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between stacked conductive bumps;
• and
• a conductive pad disposed at a periphery of an area receiving the conductive bumps on the interposer substrate so as to receive a probe.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between stacked conductive bumps;
• and
• a heat radiator attached to the interposer substrate.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between stacked conductive bumps;
• and
• a standoff member standing on the interposer substrate so as to receive at least one of the printed wiring substrate and the mounted component at its tip end.

A method of mounting a component on a printed wiring substrate, comprising:

• preparing an interposer including a standoff member standing on an interposer substrate;
• preparing conductive bumps stacked between the printed wiring substrate and the component while allowing the interposer interposed between stacked conductive bumps;
• and
• reflowing the conductive bumps while the interposer and the component are urged against the printed wiring substrate.

A multileveled printed circuit board unit comprising:

• a printed wiring substrate;
• a mounted component received above the printed wiring substrate;
• conductive bumps stacked between the printed wiring substrate and mounted component;
• an interposer substrate interposed between stacked conductive bumps;
• and
• a guide member located on the interposer substrate at a predetermined position for adjustment of a relative position between the printed wiring substrate and the mounted component.