Method of packaging a semiconductor chip

A method according to any of the preceding claims, wherein a second layer of material is placed over the non-active surface of the semiconductor chip during molding.

A method according to any of the preceding claims, wherein the electrically insulating material is molded onto the active surface of the chip prior to separation of the chip from a wafer on which the chip is formed.

A method according to any of the preceding claims, wherein the electrically insulating material is molded onto the active surface after a metallic bump height leveling process.

A semiconductor flip chip comprising a semiconductor chip having an active surface and electrical contact areas located on the active surface, a metallic bump formed on each electrical contact area and an electrically insulating material covering the active surface between the metallic bumps for attachment to an electrical contact area on a substrate, a portion of each metallic bump not being covered by the electrically insulating material.

A method of attaching a flip chip to a substrate, the method comprising molding an electrically insulating material onto an active surface of the flip chip between metallic bumps formed on first electrical contact areas on the active surface such that a portion of each metallic bump is not covered by the molding material, and subsequently attaching the metallic bumps to second electrical contact areas on the substrate.