Area-array device assembly with pre-applied underfill layers on printed wiring board

A bumped area-array device assembly, comprising:

• a bumped flip chip including an active surface and a plurality of connective bumps extending from the active surface;
• and
• an electrical substrate including a pre-applied underfill material at a flip-chip receiving region, wherein the flip chip is heated to electrically connect the connective bumps to the electrical substrate and to flow the underfill material from the flip-chip receiving region around the connective bumps to secure the flip chip to the electrical substrate.

A printed wiring board panel with pre-applied underfill material comprising:

• a single-layer or a multiple-layer printed circuit board including a pre-applied underfill material disposed on a surface of the printed circuit board at a plurality of flip-chip receiving regions, wherein the flip-chip receiving regions indicate flip-chip placement during flip-chip assembly.