Ball grid array semiconductor package and method of fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsKuo-Chu Chiang, Yu-Ting Lai, Chin Te Chen
Life of this patent
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Abstract
A ball grid array semiconductor packaging technology is provided, which is characterized in that openings of a solder mask are formed on a given edge of a die attachment area, and entire or partial width of each opening is disposed outside the die attachment area. Accordingly, air within the opening of the solder mask is sufficiently eliminated during die bonding process, so as to prevent void formation as adhesive is filled into the opening. Therefore, in the follow-up steps, high temperature in reflowing process will not cause popcorn as in the prior-art, so as to remain good quality of the semiconductor package.
Claims10
A BGA fabrication method, comprising the steps of:
- (1) preparing a substrate having a predefined die-attachment area on one surface thereof;
- (2) forming a ground pad over the die-attachment area on the substrate;
- (3) forming a solder mask over the ground pad, wherein the solder mask is formed with at least one opening to expose one portion of the ground pad, and wherein the opening is located in such a manner that a fraction of the overall width of the opening is located beyond the die-attachment area;
- (4) pasting an adhesive agent over the solder mask;
- and
- (5) pressing at least one semiconductor chip forcefully against the adhesive agent over the solder mask, causing the adhesive agent over the solder mask to spread out sideways and fill into the opening in the solder mask to expel the air in the opening through the gap above the opening to the atmosphere.
A BGA package, which comprises:
- a substrate having a predefined die-attachment area on one surface thereof;
- a ground pad over the die-attachment area on the substrate;
- a solder mask over the ground pad, where the solder mask is formed with at least one opening to expose one portion of the ground pad, and where the opening is located in such a manner that a fraction of the overall width of the opening is located beyond the die-attachment area;
- an adhesive agent over the solder mask;
- and
- at least one semiconductor chip which is mounted over the chip by means of the adhesive agent over the solder mask, with the adhesive agent filled in the opening in the solder mask substantially free of voids due to air being expelled to atmosphere through the gap formed by the fraction of the overall width of the opening beyond the die-attachment area.
Dependencies are inferred from the claim text.