Circuit device and method of manufacture thereof
AssigneesSanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.
InventorsYusuke Igarashi, Nobuhisa Takakusaki, Jun Sakano, Noriaki Sakamoto
Life of this patent
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Abstract
A circuit device 10 comprises conductive patterns 11, separated by separation grooves 41, circuit elements 12, affixed onto conductive patterns 11, and an insulating resin 13, covering circuit elements 12 and conductive patterns 11 and filling separation grooves 41 while exposing the rear surfaces of conductive patterns 11. Constricted parts 19 are formed at side surfaces of separation grooves 41. At constricted parts 19, the width of separation grooves 41 is made narrower than at other locations. Thus by making insulating resin 13 adhere closely to constricted parts 19, the adhesion of insulating resin 13 with conductive patterns 11 is improved.
Claims17
A circuit device comprising:
- conductive patterns separated by separation groove;
- circuit element, affixed onto the conductive pattern;
- and an insulating resin, covering the circuit elements and the conductive patterns and filling the separation grooves while exposing the rear surfaces of the conductive patterns;
- wherein constricted part is formed at side surface of the separation groove and the insulating resin is adhered to the constricted part.
A circuit device comprising:
- conductive patterns separated by separation groove;
- circuit element, affixed onto the conductive pattern;
- and an insulating resin, covering the circuit element and the conductive patterns and filling the separation groove while exposing the rear surfaces of the conductive patterns;
- wherein the separation groove is formed of a plurality of grooves formed by etching a plurality of times.
A circuit device manufacturing method comprising:
- forming conductive patterns by forming separation grooves at locations of a conductive foil except locations that are to be the conductive patterns;
- positioning circuit element on the conductive pattern;
- and forming an insulating resin so as to cover the circuit element and fill the separation groove;
- wherein constricted part is formed on side surfaces of the separation grooves by a plurality of times of etching and the insulating resin is adhered to the constricted part.
Dependencies are inferred from the claim text.