Semiconductor device and lead frame used therefor
AssigneeRohm Co., Ltd.
InventorKazutaka Shibata
Life of this patent
Estimating the term…
Abstract
A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.
Claims12
A semiconductor device comprising
- a semiconductor chip having electrodes on the surface thereof,
- a lead frame having a plurality of lead terminal portions for electric connection and hanging lead portions each extending obliquely with respect to the lead terminal portions and supporting a supporting portion on which the semiconductor chip is mounted,
- metal wires for connecting the lead terminal portions and the electrodes of the semiconductor chip to each other, and
- a sealing resin for sealing the semiconductor chip, the lead frame and the metal wires in such a manner that a part of each lead terminal portion is exposed,
- the plurality of lead terminal portions including chamfered lead terminal portions each having, at its head end, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.
A lead frame comprising
- a plurality of lead terminal portions for electric connection, and
- a plurality of hanging lead portions each extending obliquely with respect to the lead terminal portions and supporting a supporting portion on which a semiconductor chip is mounted,
- the plurality of lead terminal portions including chamfered lead terminal portions each having, at its head end, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.
Dependencies are inferred from the claim text.