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US 2004/0169268 A1Published application
Circuit arrangement
AssigneeSiemens Aktiengesellschaft
InventorsGerd Auerswald, Kurt Gross, Michael Kirchberger, Stefan Kulig, Hans Rappl
Life of this patent
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Abstract
The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.
Claims9
Circuit arrangement comprising:
- a power section, which comprises heat-generating components and at least one component producing less heat,
- the component producing less heat being arranged in an internal region of the circuit arrangement, and
- the heat-generating components being arranged around the internal region and being mounted on at least one metallic body acting as an electrical conductor, said body being electrically connected to the heat-generating components,
- wherein
- the body is arranged in an electrically insulating manner in the region of the heat-generating components on a heat sink, in order to cool the heat-generating components, and wherein
- the heat sink is embodied running around the internal region with the components producing less heat.
3 more elements
Dependencies are inferred from the claim text.