Compliant package with conductive elastomeric posts
AssigneeTessera, Inc.
InventorJoseph Fjelstad
Life of this patent
Estimating the term…
Abstract
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
Claims7
An assembly comprising:
- a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
- a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface;
- and
- conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
A method of manufacturing an assembly comprising:
- providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
- providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface;
- forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element;
- and
- injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
Dependencies are inferred from the claim text.