Screen printing squeegee for applying solder paste

Squeegee apparatus for applying solder paste to circuits comprising:

• a squeegee blade having a pair of elongated face sides spaced apart by selected thickness and a pair of elongated substantially parallel narrow sides spaced apart by a selected width, said elongated face sides and said elongated narrow sides joined together at squeegee operating edges;
• a slightly resilient clamping structure having a front portion and a backing portion, said front portion and backing portion defining an elongated rectangular cavity for receiving said squeegee blade, said cavity having a depth less than said selected width, first and second long edges, and a short dimension separating said first and second long edges, said short dimension being less than said selected thickness such that said clamping structure applies a gripping force to said squeegee blade when received by said cavity;
• and
• a plurality of fasteners received by said clamping structure for increasing said gripping force applied to said squeegee blade.