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US 2004/0169024 A1Published application
Methods for preparing ball grid array substrates via use of a laser
OwnerFrank L. Hallinventor
Life of this patent
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
Claims9
An automolding system comprising:
- providing a substrate having a surface;
- preheating the substrate;
- forming a resist layer;
- baking the substrate;
- and
- removing contaminants from the substrate using a laser.
3 more elements
A molding system comprising:
- providing a substrate having a surface;
- preheating the substrate;
- forming a resist layer;
- baking the substrate;
- and
- removing contaminants from the substrate using a laser.
3 more elements
A system for molding comprising:
- providing a substrate having a surface;
- preheating the substrate;
- forming a resist layer;
- baking the substrate;
- and
- removing contaminants from the substrate using a laser.
3 more elements
Dependencies are inferred from the claim text.