Cleaning of semiconductor wafers by contaminate encapsulation

An apparatus for removing contaminate particulate matter from a contaminate particle containing substrate surface comprising:

• a support for supporting a substrate containing undesirable particulate matter on the surface of the substrate;
• means for applying a sacrificial material coating on the surface of the substrate, which material is to encapsulate and suspend the undesirable particles therein;
• means for fluidizing the material if necessary;
• energy forming means to dislodge at least some of the particulate matter from the surface of the substrate into the sacrificial material coating such that the particulate matter is partially or fully encapsulated and suspended within the sacrificial material coating forming a particulate matter containing sacrificial material coating;
• and
• means for removing the particulate matter containing sacrificial material coating from the surface of the substrate providing a cleaned substrate surface.