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US 2004/0168907 A1Published application
Sintered body and film forming method using the same
OwnerToru Satoinventor
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Abstract
A sintered body comprising 95 Wt % or more germanium and tungsten. The sputtering is executed by using sintered body as a target, thereby forming a resistance film to a spacer of an image forming apparatus using electron beam emitting devices and the like. Thus, the resistance film having excellent controllability and high reproducibility can be stably formed.
Claims13
A sintered body containing 95 Wt % or more germanium and tungsten.
Dependencies are inferred from the claim text.