Selectively configurable circuit board

A processor-based system, comprising:

• a system bus;
• a processor coupled to the system bus;
• and
• a selectively configured circuit board comprising:
• a substrate having at least one component site;
• a microelectronic component carried by the substrate at the component site;
• a plurality of board leads coupled to the system bus;
• a plurality of board contacts arranged adjacent the component site, at least some of the board contacts being individually coupled to component contacts carried by the microelectronic component;
• a first trace carried by the substrate and electrically connecting one of the board contacts to one of the board leads, the first trace including a closed switch, the closed switch comprising a normally open thermally actuatable switch which has been thermally actuated to create an electrical connection;
• and
• a second trace carried by the substrate and coupled to one of the board contacts and one of the board leads, the second trace including an open thermally actuatable switch which can be selectively closed to create an electrical connection.

An actuatable trace for a microelectronic assembly, comprising:

• a first conductive length;
• a second conductive length;
• a gap disposed between and electrically separating the first and second conductive lengths and having an exposed gap surface;
• and
• a fusible member in communication with the gap, the fusible member being spaced from the first and second lengths and being formed of a fusible material which will wet the gap surface when thermally actuated to electrically connect the first and second conductive lengths across the gap.

A selectively configurable circuit board comprising:

• a substrate having at least one component site for receiving a microelectronic component;
• and
• circuitry carried by the substrate, the circuitry including a plurality of selectively actuatable traces associated with the component site, at least one of the actuatable traces comprising:
• a first conductive length;
• a second conductive length;
• a gap disposed between and electrically separating the first and second conductive lengths and having an exposed gap surface;
• and
• a fusible member in communication with the gap, the fusible member being spaced from the first and second lengths and being formed of a fusible material which will wet the gap surface when thermally actuated to electrically connect the first and second conductive lengths across the gap.

A method of manufacturing a microelectronic device assembly including a microelectronic component and a circuit board comprising:

• electrically coupling each of a plurality of component contacts of the microelectronic component to one of a plurality of board contacts carried by the circuit board, the circuit board carrying a plurality of configurable traces associated with the board contacts and each of the configurable traces includes at least one normally open thermally actuatable switch;
• identifying a first normally open thermally actuatable switch from the plurality of normally open thermally actuatable switches;
• and
• locally heating the first switch to selectively close the first switch to define an electrical pathway between at least one of the board contacts and at least one of a plurality of board leads carried by the circuit board.