Multilayer printed circuit board and multilayer printed circuit board manufacturing method
AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
Life of this patent
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Abstract
A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on the die pad 24, it is possible to prevent resin residues on the pad 24 and to improve connection characteristics between the pad 24 and a via hole 60 and reliability.
Claims20
A multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized in that
- an electronic component is included in said substrate.
A multilayer printed circuit board having interlayer insulating layers and conductor layers repeated formed on a substrate, via holes formed in the interlayer insulating layers, and establishing connection through the via holes, characterized in that
- an electronic component is included in said substrate;
- and
- a transition layer to be connected to the via hole of a lowermost interlayer insulating layer is formed on a pad portion of said electronic component.
A multilayer printed circuit board having interlayer resin insulating layers and conductor circuits repeatedly formed on a substrate including an electronic component, characterized in that
- a transition layer to be connected to the via hole of a lowermost interlayer resin insulating layer is formed to consist of at least two layers on a pad portion of said electronic component.
A multilayer printed circuit board having interlayer resin insulating layers and conductor layers repeatedly formed on a substrate including an electronic component, characterized in that
- a transition layer to be connected to the via hole of a lowermost interlayer resin insulating layer is formed to consist of a first thin film layer, a second thin film layer and a thickening layer, on a pad portion of said electronic component.
A method of manufacturing a multilayer printed circuit board having interlayer resin insulating layers and conductor layers repeatedly formed on a substrate including an electronic component, characterized in that
- a transition layer is formed on the electronic component through at least the following steps (a) to (c):
- (a) forming a first thin film layer and a second thin film layer on an entire surface of the substrate into which said electronic component is embedded;
- (b) providing a resist on said thin film layer, and forming a thickening layer on portions on which the resist is not formed;
- and p1 (c) removing the thin film layers by etching.
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized by comprising at least the following steps (a) to (c):
- (a) containing an electronic component in said substrate;
- (b) forming a positioning mark on said substrate based on a positioning mark of said electronic component;
- and
- (c) conducting working or formation based on the positioning mark of said substrate.
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized by comprising at least the following steps (a) to (d):
- (a) containing an electronic component in said substrate;
- (b) forming a positioning mark on said substrate based on a positioning mark of said electronic component by using laser;
- (c) forming a metallic film on the positioning mark of said substrate;
- and
- (d) conducting working or formation based on the positioning mark of said substrate.
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized by comprising at least the following steps (a) to (e):
- (a) containing an electronic component in said substrate;
- (b) forming a positioning mark on said substrate based on a positioning mark of said electronic component by using laser;
- (c) forming a metallic film on the positioning mark of said substrate;
- (d) forming the interlayer insulating layers on said substrate;
- and
- (e) processing or forming via hole openings in said interlayer resin insulating layers based on the positioning mark of said substrate.
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized by comprising at least the following steps (a) to (e):
- (a) containing an electronic component in said substrate;
- (b) removing a film on a surface of a die pad of said electronic component;
- (c) forming a transition layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad;
- (d) forming the interlayer insulating layers on said substrate;
- and
- (e) forming the via holes connected to the conductor circuits and the transition layers, in said interlayer resin insulating layers.
A multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, characterized in that
- an electronic component is included in said substrate;
- a transition layer to be connected to a via hole of a lowermost interlayer insulating layer is formed on a die pad of said electronic component;
- and
- a film on a surface of said die pad is removed.
Dependencies are inferred from the claim text.