Header assembly for optoelectronic devices

A header assembly, comprising:

• a base having a first side and a second side;
• a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
• and
• a thermal control element attached at least indirectly to the platform.

A header assembly, comprising:

• a base substantially having a device side and a connector side;
• a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
• a device mounted indirectly to the inside portion of the platform;
• and
• means for transferring heat, the means for transferring heat being thermally coupled with the device.

An optoelectronic device, comprising:

• a header assembly, comprising:
• a base having a first side and a second side;
• a platform attached to the base and disposed in a predetermined orientation with respect to the base, the platform having an inside portion proximate the first side of the base and an outside portion proximate the second side of the base, and the platform including at least one conductive pathway extending substantially through the platform;
• and
• at least one optical device at least indirectly attached to the platform;
• and
• a printed circuit board electrically connected with the header assembly.