Semiconductor processing apparatus
AssigneeHitachi High-Technologies Corporation
InventorsSeiichiro Kanno, Ryoji Nishio, Ken Yoshioka, Saburou Kanai, Hideki Kihara, Hideyuki Yamamoto
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Abstract
A semiconductor processing apparatus that processes a semiconductor wafer disposed in a process chamber of a processing apparatus main unit 38 comprises: a setting unit 33 for enabling a user to set a temperature of the semiconductor wafer; and a control unit 26 for controlling a processing of the semiconductor wafer based on the temperature of the semiconductor wafer set by the setting unit.
Claims8
A semiconductor processing apparatus that processes a semiconductor wafer mounted therein, comprising:
- setting means for enabling a user to set a temperature of said semiconductor wafer;
- and
- control means for controlling a processing of the semiconductor wafer based on said temperature of the semiconductor wafer set by the setting means.
A semiconductor processing apparatus that plasma-processes a semiconductor wafer mounted on a stage placed in a container, comprising:
- setting means for enabling a user to set a temperature of said semiconductor wafer;
- and
- control means for controlling an operation of the semiconductor processing apparatus based on information about the temperature of the semiconductor wafer set by the setting means.
Dependencies are inferred from the claim text.