Apparatus and methods for reducing damage to substrates during megasonic cleaning processes
AssigneeGoldfinger Technologies, LLC
InventorsMario E. Bran, Michael B. Olesen, Yi Wu
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AssigneeGoldfinger Technologies, LLC
InventorsMario E. Bran, Michael B. Olesen, Yi Wu
Estimating the term…
The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.
An assembly for cleaning a thin, flat substrate, the assembly comprising:
An apparatus for cleaning a thin, flat substrate, the apparatus comprising:
Apparatus for cleaning a thin article having at least a first substantially planar surface, the apparatus comprising:
A method of cleaning a thin, flat substrate, the method comprising the steps of:
Dependencies are inferred from the claim text.