Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsToshihisa Nozawa, Satoru Kawakami
Life of this patent
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Abstract
A substrate processing apparatus 1 has: sensors 21 and 22 provided in an etching chamber 14 and configured to detect a relative position between the etching chamber 14 and a wafer transfer mechanism 23; a control section 38 configured to correct positional displacement; a motor controller 39; a motor 28; and a motor 30. Since the positional displacement of a wafer W can be corrected, the wafer transfer mechanism 23 is capable of carrying the wafer W into the etching chamber 14 without causing any positional displacement, so that the wafer W can be placed on a susceptor 19 at a proper position.
Claims11
A substrate processing apparatus, comprising:
- a first process chamber in which a first process disposes a substrate;
- a second process chamber in which a second process disposes the substrate that has finished the first process;
- a transfer mechanism configured to transfer the substrate and carry the substrate into and out of said first process chamber and said second process chamber;
- a detecting mechanism configured to detect a relative position between the substrate to be carried into said second process chamber by said transfer mechanism and the second process chamber;
- and
- a correcting mechanism configured to correct displacement of the relative position based on a result of the detection by said detecting mechanism.
A substrate processing method of a substrate processing apparatus including:
- a first process chamber in which a first process disposes a substrate;
- a second process chamber in which a second process disposes the substrate;
- and a transfer mechanism configured to transfer the substrate and carry the substrate into and out of the first process chamber and the second process chamber, said method including:
- (a) applying the first process on the substrate in the first process chamber;
- (b) carrying the substrate out of the first process chamber by the transfer mechanism after said step (a);
- (c) carrying the substrate, which is carried out of the first process chamber, into the second process chamber by the transfer mechanism;
- (d) detecting a relative position between the substrate to be carried into the second process chamber by the transfer mechanism in said step (c) and the second process chamber;
- and
- (e) correcting displacement of the relative position based on a result of the detection of said step (d).
A substrate transfer device, comprising:
- a base portion;
- at least two holding portions each capable of holding a substrate;
- an arm portion coupling said at least two holding portions to each other and connected to said base portion;
- and
- a driving portion configured to drive said arm portion, thereby driving said at least two holding portions to move back and forth synchronously.
A substrate transfer device, comprising:
- a base portion;
- two holding portions each capable of holding a substrate;
- an arm portion coupling said two holding portions to each other and connected to said base portion;
- and
- a driving portion configured to drive said arm portion, thereby driving said two holding portions to move back and forth so as to become apart from and close to each other.
A substrate transfer device, comprising:
- a base portion;
- and
- a plurality of transfer mechanisms provided on said base portion, each of said transfer mechanisms including:
- two holding portions each capable of holding a substrate;
- an arm portion coupling the two holding portions to each other and connected to said base portion;
- and a driving portion configured to drive the arm portion, thereby driving the two holding portions to move back and forth so as to become apart from and close to each other.
Dependencies are inferred from the claim text.