Low profile multi-IC chip package connector
OwnerWalter L. Moden, Jerrold L. King +1inventors
InventorsWalter L. Moden, Jerrold L. King, Jerry M. Brooks
Life of this patent
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Abstract
A low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.
Claims4
A method for connecting a horizontally stacked plurality of primary integrated circuit packages on a substrate having a plurality of circuits thereon, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, using a cage having an open side, comprising:
- providing a cage enclosing at least two sides of the plurality of sides of each primary integrated circuit package of the stacked plurality of primary integrated circuit packages;
- and
- attaching the cage to the substrate, the cage connecting the at least one outer lead of the outer leads of the stacked plurality of primary integrated circuit packages to the at least one conductive bus of the plurality of spaced transverse conductive buses.
A method for connecting a horizontally stacked plurality of primary integrated circuit packages on a substrate having a plurality of circuits thereon, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, comprising:
- providing a cage enclosing at least two sides of the plurality of sides of each primary integrated circuit package of the stacked plurality of primary integrated circuit packages;
- and
- attaching the cage to the substrate, the cage connecting the at least one outer lead of the outer leads of the stacked plurality of primary integrated circuit packages to the at least one conductive bus of the plurality of spaced transverse conductive buses.
A method for connecting a horizontally stacked plurality of primary integrated circuit packages on a substrate having a plurality of circuits thereon, each primary integrated circuit package having a plurality of outer leads and having a plurality of sides, comprising:
- providing a cage enclosing at least three sides of the plurality of sides of each primary integrated circuit package of the stacked plurality of primary integrated circuit packages;
- and
- attaching the cage to the substrate using one of adhesive and snap pins fitting in holes in the substrate, the cage connecting the at least one outer lead of the outer leads of the stacked plurality of primary integrated circuit packages to the at least one conductive bus of the plurality of spaced transverse conductive buses, a portion of the semi-continuous flexible tape located within the cage.
Dependencies are inferred from the claim text.